Direct Bonding of High Dielectric Oxides for High-Performance Transistor Applications

Jikai Xu,Chenxi Wang,Xiaoliang Ji,Qi An,Yanhong Tian,Tadatomo Suga
DOI: https://doi.org/10.1016/j.scriptamat.2019.11.055
IF: 6.302
2020-01-01
Scripta Materialia
Abstract:We developed a plasma activation process using a gas mixture of O2/NH3/H2O for direct bonding, which realized the combination of bulk aluminum oxide (Al2O3) and yttria-stabilized cubic zirconia (YSZ) without interlayers for the first time. The bonding could withstand multiple mechanical grinding and polishing processes and exhibited sufficient bonding strength for device micro/nanofabication. A nanoscale, sharp, and layered crystalline bonding interface with fewer grain boundaries was confirmed by transmission electron microscopy. The interfacial structure is well-suited for superior performance in high dielectric constant metal–oxide–semiconductor field-effect transistors. Moreover, this bonding method is universal for the fabrication of Al2O3/SiO2 and YSZ/SiO2 heterostructures.
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