Thermal Transport and Energy Dissipation in Two-Dimensional Bi2O2Se

Fang Yang,Ridong Wang,Weiwei Zhao,Jie Jiang,Xin Wei,Ting Zheng,Yutian Yang,Xinwei Wang,Junpeng Lu,Zhenhua Ni
DOI: https://doi.org/10.1063/1.5123682
IF: 4
2019-01-01
Applied Physics Letters
Abstract:Thermal transport and energy dissipation are important for a material in both thermoelectric and electronic devices. Here, we investigate the lateral and interfacial thermal transport of two-dimensional (2D) Bi2O2Se by Raman spectroscopy. It is found that thin Bi2O2Se flakes have a low in-plane thermal conductivity while maintaining an appropriate interfacial thermal conductance. The in-plane thermal conductivity of Bi2O2Se decreases with decreasing thickness, to as low as 0.92 +/- 0.18 Wm(-1)K(-1) at a thickness of similar to 8 nm. Such a low thermal conductivity is derived from the low phonon group velocity, strong anharmonicity, and large surface scattering of acoustic phonons of the Bi2O2Se thin layer. Simultaneously, thinner Bi2O2Se presents a higher thermal dissipation to the substrate than the thicker counterparts in the device. The interfacial thermal conductance increases with decreasing thickness, and reaches similar to 21 MWm(-2)K(-1) at similar to 8 nm. These results provide critical information for the design of thermoelectric devices with high figures of merit and electronics with low-power consumption based on 2D materials.
What problem does this paper attempt to address?