Abstract:Immersion direct contact cooling effectively transfers heat from electronic components to a cooling solution without additional thermal resistance, due to its high energy density, low power consumption, system simplicity, and integrated thermal management for electronic devices. Current scholarly research on immersed structures predominantly focuses on surface temperature effects, with a scant investigation into internal flow and temperature field distributions concerning boundary layers. This study addresses structural optimization in immersion cooling systems, employing experimental and simulation methods to elucidate the thermal mechanisms by which structural optimization impacts the performance of chip immersion cooling systems. The research examines the impact of panel spacing and liquid level height on the thickness of velocity and thermal boundary layers, as well as the combined effects of natural and forced convection under three distinct cooling modes. Analysis reveals that heat pipe immersion cooling can reduce the heat source junction temperature to 40.7 °C under a 60 W power dissipation, a 47.2 % decrease from the bare heat source temperature. Reducing panel spacing disrupts the thermal boundary, enhancing forced convection and lowering the junction temperature by up to 10.1 % (6.5 °C). As liquid level height increases, the junction temperature initially decreases and then rises, with an optimal height of 175 mm for the best overall heat transfer effect. At low flow velocities (0.04 m/s), the vertical buoyancy-induced flow velocity at the heat source surface (24.2 × 10 -6 m/s) exceeds the horizontal forced convection velocity (0.78 × 10 -6 m/s), indicating that buoyancy changes due to density differences are significant and must be considered.

Thermal structure optimization of a supercondcuting cavity vertical test cryostat

Heat Leakage of a Vertical Test Cryostat for Superconducting Cavity Based on Variable Arranged Radiation Shield

Numerical Study on the Working Performance of a G-M Cryocooler with a Mechanically Driven Displacer

Numerical Simulation and Experimental Verification of Dynamic Cooling and Temperature Control of the Optical Cavity in a Co2 Isotope Analyzer

Heat transfer of insulation structure for large cryogenic wind tunnel

Dynamic Thermal Performance of Cryogenic Liquid Hydrogen Heating from Gas-Liquid Stratification to Supercritical under a Constant Heat Flux Condition: A Two-Step Simulation

Continuous Wave Mode Test of Conduction-Cooled Nb3Sn Radio Frequency Superconducting Cavities at Peking University

A NEW CRYOGENIC HEAT TRANSFER UNIT USED IN COOLING SUPERCONDUCTING MAGNET

Experimental investigation on heat transfer performance of a cryogenic thermosyphon

Development of a superconducting undulator cryostat based on the thermosiphon effect

Structural Optimization and Mechanical Simulation of MEMS Thin-Film Getter–Heater Unit

Experimental and numerical study of structural parameters on the heat transfer performance of submerged cooling system

Semi-Dry Cooling Solutions for Future Superconducting Accelerator Structures

Study of W/Cu Flat-Type Mock-Ups with Novel Hypervapotron Cooling Structure for CFETR Divertor

Numerical Investigation of the VB Growth of CaF2 Crystal with Supercooled Crucible Wall

A novel structure tube for supercritical CO 2 turbulent flow with high non-uniform heat flux

Experimental study on frost layer's thermal conductivity of cryogenic vertical plate under natural convection condition

Thermal design of a novel heat sink cooled by natural convection with phase transition in the series loop

Thermal optimization of a high heat load liquid-metal-bath cooled mirror at the Hefei Advanced Light Facility

Design and realization of a 3-K cryostat for a 10-cm ultrastable silicon cavity

Experimental investigation on the thermal performance of vapor chamber in a compound liquid cooling system