Planar Direction‐Dependent Interfacial Properties in Monolayer In2Se3–Metal Contacts

Chen Yang,Xiuying Zhang,Xiaotian Sun,Han Zhang,Hao Tang,Bowen Shi,Hua Pang,Linqiang Xu,Shiqi Liu,Jie Yang,Jiahuan Yan,Lin Xu,Zhiyong Zhang,Jinbo Yang,Dapeng Yu,Jing Lu
DOI: https://doi.org/10.1002/pssb.201900198
2019-01-01
Abstract:2D semiconductor materials are promising channel materials in the next generation of field‐effect transistors (FETs). Recently, 2D In2Se3 has been fabricated and predicted to present planar direction‐dependent electrical properties. Herein, ab initio quantum transport simulations are used to explore the interfacial properties between monolayer (ML) In2Se3 and a series of common metal electrodes in a FET. By reversing the planar direction of ML In2Se3, different lateral interfacial properties are obtained: A highly desirable n‐type ohmic contact is shaped between Au and up‐directed ML In2Se3; however, a p‐type Schottky contact appears when the direction is switched. In addition, Ag can generate desirable lateral n‐type ohmic contact with both the directions of ML In2Se3. A reversion from n‐ to p‐type lateral Schottky contact occurs in both In and Sc when the direction switches from up to down. Down‐directed ML In2Se3 is dynamically unstable with the Pt and transforms into up‐direction to form a p‐type ohmic contact. The average pinning factor is 0.12 and 0.09 for up‐and down‐directed ML In2Se3, respectively, implying a strong Fermi‐level pinning. Therefore, the planar direction‐dependent interfacial properties of ML In2Se3–metal contacts are understood deeply, which can be exploited for the ML In2Se3 FET devices.
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