A Novel Out-Of-Plane Electrothermal Bistable Microactuator

Liang Zhou,Huikai Xie
DOI: https://doi.org/10.1109/TRANSDUCERS.2019.8808360
2019-01-01
Abstract:This paper reports an out-of-plane bistable ectrothermal microactautor that is comprised of inverted-service-connected (ISC) Cu/W-based multirnorphs. S-shaped ISC multimorphs have been previously employed for generating large vertical displacement. In this work, the ISC multimorphs have been engineered into a warped shape via pre-stressed W and unbalanced SiO2 encapsulation layers. Electrothermal bistable actuators based on the warped ISC multimorphs have been fabricated and tested. A bistable vertical displacement of 25 mu m has been obtained.
What problem does this paper attempt to address?