Effect of Ph Value and Glycine in Alkaline CMP Slurry on the Corrosion of Aluminum by Electrochemical Analysis

Zhi Wang,Ming Sun,Xinhuan Niu,Jiakai Zhou,Yaqi Cui
DOI: https://doi.org/10.1149/2.0221906jss
IF: 2.2
2019-01-01
ECS Journal of Solid State Science and Technology
Abstract:As the feature size of integrated circuit (IC) shrinks down to 28nm and below, Aluminum (Al) is considered to be one of the suitable gate materials. During chemical mechanical polishing (CMP) of the Al gate, Al is very easy to be scratched. The purpose of Al gate polishing is to achieve effective removal and improve surface quality. The pH value and additives of slurry are critical factors affecting the material removal rate and the surface quality. Taking the advantage of enhancing chemical action and solubility of product in CMP process, the potentio dynamic polarization measurements with dynamic impedance monitoring were performed to evaluate the effects of pH value and glycine on the behavior of the electrochemical corrosion. The results showed that the corrosion potential decreased as the pH value and glycine concentration increased. Meanwhile, the dissolution rate and reversing proportion to the polarization resistance increased with the increasing of pH value and glycine concentration, the removal rate of by-products (Al(OH) 3) from the interfacial reaction accelerated, and the chemical adsorption of NH2- group identified by FTIR was converted into a soluble form, the removal rate was increased from 216 angstrom/min to 594 angstrom/min, and the surface roughness was greatly reduced from 18.6nm to 1.57nm. The synergetic effects of pH and glycine, combined with the analysis of the EIS for the aluminum alkaline CMP, indicated the RR and the surface quality of aluminum after CMP was obviously improved due to the chemical dissolution efficiency of interfacial by-product enhanced. (c) The Author(s) 2019. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution Non-Commercial No Derivatives 4.0 License (CC BY-NC-ND, http://creativecommons.org/licenses/by-nc-nd/4.0/), which permits non-commercial reuse, distribution, and reproduction in any medium, provided the original work is not changed in any way and is properly cited. For permission for commercial reuse, please email: oa@electrochem.org.
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