Abstract:Electromagnetic (EM) and circuit modeling are the prevailing practices for the anticipation and extraction of data transfer performances of 3D interconnects in a system-in-package (SiP). In comparison, this paper proposes a more abstract and cost-efficient evaluation method and an enhancement method thereof from the perspective of network information theory and communication channel modeling. Firstly, as the basis of the modeling, effects of non-idealities along data path and interferences are investigated by EM and circuit modeling and simulations, adopting typical 3D data links and their neighboring data lines as examples. Then, a channel model covering the data link of interest, based on network information theory, is established to anticipate its bit error rate (BER) as a key performance index up to a bit rate of 10Gbps, which is demonstrated to be intuitive and time-efficient. Eventually, a performance enhancement measure is proposed utilizing channel coding. The effectiveness and overhead of 2 codes with error correction capabilities are evaluated against un-coded scenario, realizing an BER enhancement from 10exp(-1) to 10exp(-5). In comparison, most conventional measures are more physical ones like shielding and complex error-proof transceivers configurations, which are often prohibitive in SiP scenario due to cost or overhead reasons. Thus, the method proposed may not only be a cost-efficient supplement to existing design methodologies but as more intuitive and insightful one on a higher level of design.

Modeling and Analysis of Signal Integrity of High-Speed Interconnected Channel with Degraded Contact Surface

State Influence of Adjacent Conductors Distributed Around Tested Channel in High-Speed Connector on Electromagnetic Measurement

Modeling and Characterization of On‐Chip Interconnects

Methods and designs for improving the signal integrity for 3D electrical interconnects in high performance IC packaging

Signal Integrity Simulation and Analysis in High-Speed Interconnects by Using FDTD

Research on Signal Integrity in High-Speed Interconnection Channel Based on SIwave

A Wideband Model for On-Chip Interconnects with Different Shielding Structures

A Coupled Efficient and Systematic Full-Wave Time-Domain Macromodeling and Circuit Simulation Method for Signal Integrity Analysis of High-Speed Interconnects

Analysis of Signal Propagation in High-Speed Differential Signal Lines with Full-Wave Time-Domain Technique

Analysis of Signal Propagation on High‐speed Planar Interconnect Systems Based on Full‐wave and Macromodeling Techniques

Method for system-level signal and power integrity modeling of high-speed electronic packages

Signal Propagation Effects on High‐speed Interconnection Lines Using Time‐domain Numerical Technique

Efficient Signal And Power Integrity Analysis By Using Modal Decomposition And Integral Equations

Modeling And Evaluation Of Common-Mode Interference Coupling Effects On Sensitive Cable In Motor Drive System

Design and signal integrity simulation of high speed digital system

Analysis of System Level Signal Integrity for High Speed Interface Design Based on GTY Transceivers

Analysis of reflection in high-speed digital design

Electromagnetic modeling and transient simulation of interconnects in high speed VLSI

Data Transfer Performance Analysis and Enhancement of Critical 3D Interconnects in a 3D SiP Based on Communication Channel Modeling Methodology

Signal Integrity Analysis For High-Speed Circuit Pcb Interconnection With An Efficient Full Wave Method

Modeling and Analysis of Signal Transmission with Through Silicon Via (TSV) Noise Coupling