Abstract:Flexible and stretchable inorganic electronics, offering the high performance of conventional electronics with the ability to be deformed like a rubber, integrate inorganic electronic materials with flexible substrates and has enabled many novel applications ranging from curvilinear electronics, epidermal electronics to bio-integrated electronics. However, inorganic electronic materials (e.g., silicon) cannot be fabricated directly on a flexible substrate due to the extreme processing conditions (e.g., high temperature). To overcome this challenge, transfer printing techniques have been developed to pick up inorganic thin films from the grown substrate and transfer them onto the receiver substrate for the heterogeneous integration. This approach separates the fabrication substrate with the application substrate and provides a most promising solution for the integration of inorganic electronic materials with flexible substrates to develop flexible and stretchable electronics. This paper provides a brief review of recent advances on mechanics of transfer printing techniques for flexible and stretchable inorganic electronics including kinetically controlled transfer printing technique, shear-enhanced transfer printing technique, gecko inspired transfer printing technique, surface-relief-assisted transfer printing technique, laser-driven transfer printing technique, bending curvature controlled transfer printing technique and tape transfer printing technique. The basic concepts for each transfer printing technique are overviewed to illustrate the key roles of mechanics in the development of transfer printing techniques. Despite the successful developments of various transfer printing techniques, several challenges still exist for future transfer printing techniques with the capabilities of transfer printing of nano-devices and direct three-dimensional transfer printing in a large-scale and high-efficiency manner.

Transfer Printing of VO2 Thin Films Using MoS2/SiO2 Van Der Waals Heterojunctions

Sputtering Flexible VO 2 Films for Effective Thermal Modulation

Transfer Printing Techniques for Flexible and Stretchable Inorganic Electronics

Flexible VO2 thermochromic films with narrow hysteresis loops

Recent Advances on Mechanics of Transfer Printing for Flexible and Stretchable Electronics

Enhanced Metal-Insulator Transition Performance in Scalable Vanadium Dioxide Thin Films Prepared Using a Moisture-Assisted Chemical Solution Approach

Tuning the Metal-Insulator Transition of Vanadium Dioxide Thin Films Using a Stretchable Structure

Van Der Waals Epitaxy of Functional MoO2 Film on Mica for Flexible Electronics

Low Temperature Fabrication of High-Performance VO2 Film Via Embedding Low Vanadium Buffer Layer

Flexible and reconfigurable radio frequency electronics realized by high-throughput screen printing of vanadium dioxide switches

Etching-free transfer of wafer-scale MoS2 films

Marangoni Force Assisted Spreading and Printing of Nanometer‐Thick Polymer Films for Ubiquitous Optoelectronic Devices

A review of the preparation, properties and applications of VO2 thin films with the reversible phase transition

A Universal Etching-Free Transfer of MoS 2 Films for Applications in Photodetectors

High-Mobility Flexible Oxyselenide Thin-Film Transistors Prepared by a Solution-Assisted Method

Enhanced Metal–Insulator Transition in Freestanding VO 2 Down to 5 nm Thickness

Facile Fabrication of High-Performance Thermochromic VO2-Based Films on Si for Application in Phase-Change Devices

Robust atmospherically stable hybrid SrVO3/Graphene//SrTiO3 template for fast and facile large-area transfer of complex oxides onto Si

Ambient printing of native oxides for ultrathin transparent flexible circuit boards

A Photochemical Approach toward High‐Fidelity Programmable Transfer Printing

Growth of Vanadium Dioxide Thin Films on Pt Metal Film and the Electrically-Driven Metal-Insulator Transition Characteristics of Them