An Injection Enhanced LIGBT on Thin SOI Layer Compatible with CMOS Process

Gaoqiang Deng,Xiaorong Luo,Tao Sun,Zheyan Zhao,Diao Fan,Bo Zhang
DOI: https://doi.org/10.1109/ted.2019.2912770
IF: 3.1
2019-01-01
IEEE Transactions on Electron Devices
Abstract:In this paper, we present a lateral injection enhanced insulated gate bipolar transistor (LIEGT) and investigate its mechanism. The LIEGT features a recessed trench at the cathode side of the drift region formed by LOCal oxidation of silicon (LOCOS) process. The recessed trench suppresses holes being extracted and enhances the electron injection, thus contributing to a very low loss in the ON-state. The ON-state voltage (V-ON) of the LIEGT is reduced by 24% at the current density of 200 A/cm(2) and the saturation current is 40% higher than that of the conventional lateral insulated gate bipolar transistor (LIGBT). The LIEGT exhibits an improved tradeoff between V-ON and turnoff loss (E-OFF). For the same V-ON, the E-OFF is decreased by 38% compared with that of the conventional LIGBT.
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