Abstract:Abstract In this paper, we propose a thermal wind speed sensor Verilog-A model with thermal-fluid-electric hybrid characteristics. Because the structure of the thermal wind sensor and the interface circuit chip are designed separately, which cannot effectively carry out MEMS-IC (integrated circuit) co-simulation, the overall performance of the sensor and interface circuit chip is prone to large deviation. At the same time, the separation of MEMS structure and IC design process leads to long product development cycle and high cost. This paper proposes an improved simulation model by analyzing the behavior characteristics of the thermal wind speed sensor. The simulation model consists of 11 thermistors, 3 capacitors, a voltage-controlled voltage source, and a voltage-controlled current source. The Taylor series expansion of the differential equation of heat conduction is carried out, and then the thermistor and capacitor networks are established according to the corresponding relationship between the thermal parameters and the electrical parameters, including the thermal conduction unit, the convection unit and the heat capacity in the chip. The model fully considers the effects of various physical effects and parasitic effects, and is implemented using the hardware description language Verilog-A. The sensor and interface circuit can be simulated simultaneously to optimize the circuit design. It is beneficial to the integration of sensors and interface circuit, reducing the number of tape-outs, increasing the success rate, and reducing costs. The consistency between the simulation results and the experimental curves verified the correctness of the macro model. The behavior characteristics of constant power (CP) and constant temperature heating were described. In CP mode, the output voltage error is less than ± 6.5%, the chip temperature error is less than 4.0%. The presented modeling approach can be the basis for the development of complete MEMS-IC design technology library of thermal wind speed sensor, aiming at optimum designs of integrated thermal wind speed sensor.

Modeling of Packaged MEMS Thermal Wind Sensor Operating on CP Mode

Annular-Encapsulation Packaging To Realize High-Performance Mems Thermal Wind Sensor

Modelling and Characterization of a Robust, Low-Power and Wide-Range Thermal Wind Sensor

Analytic Model of Dual-Layer-Structure MEMS Thermal Wind Sensor with Increased Sensitivity

An Efficient Macromodel Extraction Strategy for Packaged MEMS Thermal Wind Sensor Considering Multiphysics

Experiment Of The Mems Wind Sensor Based On Temperature-Balanced Mode

An efficient macro model for CMOS-MEMS thermal wind speed sensor

Linearity and Sensitivity Analysis of MEMS Thermal Wind Sensor via Analytical Model

Low-Drift MEMS Thermal Wind Sensor With Symmetric Packaging Using Plastic Injection Molding Process

Efficient system-level simulations of thermal wind sensors considering environmental factors

Investigation of Housing on Packaged MEMS Wind Sensors for Industrial Application

Development of A Self-Packaged 2d Mems Thermal Wind Sensor for Low Power Applications

Experimental Study of a Dual-Mode Control MEMS Wind Sensor with High Accuracy

CMOS thermal wind sensor and its package

Effect of Packaging Asymmetry on the Performance of A 2d Mems Thermal Wind Sensor with Different Heating Geometries

Ceramic Film Packaging for 2-D Thermal Wind Sensor Using LTCC Technology

Design of a 2D Thermal Wind Sensor Based on MEMS Process

Design and Optimization of Interface Circuits of MEMS Thermal Wind Speed Sensor Based on a Macro Model

Influence of Aerodynamic Housing on the Performance of MEMS Wind Sensor

A 2D Wind Sensor Using the $\Delta$ P Thermal Feedback Control

Numerical Modeling of the Performance of Thermoelectric Module with Polydimethylsiloxane Encapsulation