Pressure-dependent thermal network for press-pack power module with prognostics of mechanical status

Yao Chang,Yu Zhou,Ankang Zhu,Haoze Luo,Wuhua Li,Chushan Li,Francesco Iannuzzo,Xiangning He
DOI: https://doi.org/10.17775/CSEEJPES.2021.06660
IF: 6.014
2022-01-01
CSEE Journal of Power and Energy Systems
Abstract:The press-pack power module with multi-chip layout has drawn increasing attention from industry and academia and its thermal analysis becomes an essential issue. However, the pressure-dependent thermal variables such as thermal contact resistance and thermal coupling resistance are often neglected. In this paper, a pressure-dependent thermal network model is developed to characterize the thermal performance and mechanical status of press-pack power modules. By including the thermal contact resistance and thermal coupling resistance as the function of pressure, the proposed model enables a more precise thermo-mechanical evaluation inside the press-pack power module. The influence of pressure on self-heating effects and thermal coupling effects of power modules is studied with the knowledge of elastic mechanics. A press-pack prototype with variable pressure loads is assembled. Then the thermal experiments under different pressure on chips are conducted and the pressure-variable temperature responses of thermal network are measured. Consequently, the feasibility of proposed thermal network model is validated. A cost-effective prognostic method on the mechanical status of press-pack power module is also achieved. <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">1</sup>
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