Abstract:Recently, stretchable inorganic electronic devices are rapidly developed, comprising emerging design strategies and fabrication techniques for assembling high‐performance electronic components in slight, soft, and flexible forms, with broad medical and industrial applications. Although reliable encapsulation plays an indispensable role in offering physical and chemical protection for flexible devices, there are relatively few studies on flexible encapsulation, and conventional encapsulation methods still suffer from low stretchability. Herein, a generic fluid microchannel encapsulation method is proposed, in which the device interconnects are wrapped by ultraminiaturized fluid microchannels, enabling free bucking during deformation to tremendously improve the device stretchability. Experimental analysis and finite element analysis demonstrate the substantial stretchability enhancement for the proposed method in contrast to the conventional method, which can increase by ≈100% for general 2D serpentine interconnects and ≈360% for fractal 2D serpentine interconnects. Additionally, a highly stretchable LED device serves as an example to demonstrate the utility of the proposed method for maintaining such an enormous stretchability improvement at the device level. Inorganic flexible electronics after being processed by conventional encapsulation would suffer from great stretchability reduction. Here, a generic fluid microchannel encapsulation method is proposed, in which the device interconnects are wrapped by ultraminiaturized fluid microchannels, enabling free bucking during deformation to tremendously improve the device stretchability.

A Generic Soft Encapsulation Strategy for Stretchable Electronics

Stretchability of Encapsulated Electronics

Fluid Microchannel Encapsulation to Improve the Stretchability of Flexible Electronics

Soft Elastomers with Programmable Stiffness As Strain-Isolating Substrates for Stretchable Electronics.

Design strategy of porous elastomer substrate and encapsulation for inorganic stretchable electronics

Stretchable, Curvilinear Electronics Based on Inorganic Materials

Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates

Design of Strain-Limiting Substrate Materials for Stretchable and Flexible Electronics

Mechanically-Guided Structural Designs in Stretchable Inorganic Electronics.

Designing Thin, Ultrastretchable Electronics with Stacked Circuits and Elastomeric Encapsulation Materials.

Mechanics of stretchable inorganic electronic materials

Soft elastomeric composite materials with skin-inspired mechanical properties for stretchable electronic circuits.

A Mechanically Interlocking Strategy Based on Conductive Microbridges for Stretchable Electronics

Mechanics and Thermal Management of Stretchable Inorganic Electronics.

Optimized Structural Designs for Stretchable Silicon Integrated Circuits

Soft Elastomers with Ionic Liquid‐Filled Cavities As Strain Isolating Substrates for Wearable Electronics

Stiffness and Interface Engineered Soft Electronics with Large-Scale Robust Deformability

Mechanics of Stretchable Electronics

Complementary Metal Oxide Silicon Integrated Circuits Incorporating Monolithically Integrated Stretchable Wavy Interconnects

Three-dimensional Integrated Stretchable Electronics

Stretchable and Foldable Silicon Integrated Circuits