Progress in Interface Modification and Nanoscale Study of Diamond/Cu Composites

Zhang Di,Yuan Mengying,Tan Zhanqiu,Xiong Ding-Bang,Li Zhiqiang
DOI: https://doi.org/10.11900/0412.1961.2018.00355
IF: 1.797
2018-01-01
ACTA METALLURGICA SINICA
Abstract:Due to the superiority in high thermal conductivity, low thermal expansion and good resistance from heat and corrosion, diamond/Cu composites show great prospect in thermal management applications. However, the thermal properties of diamond/Cu composites are impeded by their interface incompatibility. Interface modification is an effective method to enhance interfacial bonding and reduce interfacial thermal resistance. Based on the principles and factors related with interface design, this paper briefly reviewed some hot topics in diamond/Cu composites, including the main research progress, issues remained to be solved and nanoscale interface design with layer thickness lower than 200 nm, and its prospect of the future development.
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