Abstract:Micro-interconnection copper pillar bumps are being widely used in the packaging areas of memory chip and high performance computer due to their high density, good conductivity and low noise. Studying the interfacial behavior of copper pillar bump is of great significance for understanding its failure mechanism and microstructure evolution in order to improve the reliability of flip chip package. The thermoelectric stress test, in-situ monitor, infrared thermography test, and microstructure analysis method are employed to study the interfacial reaction, life distribution, failure mechanism and their effect factors of Cu/Ni/SnAg1.8/Cu flip chip copper pillar interconnects under 9 groups of thermoelectric stresses including 2104-3104 A/cm2 and 100-150°C. Under thermoelectric stresses, the interfacial reaction of Cu pillar can be divided into three stages:Cu6Sn5 growth and Sn solder exhaustion; the Cu6Sn5 phase transformation, exhaustion and the Cu3Sn phase growth; voids formation and crack propagation. The rate of Cu6Sn5 phase transforming into Cu3Sn phase is positively correlated with the current density. There are four kinds of failure modes including Cu pad consumption, solder complete consumption and transformation into Cu3Sn, Ni plating layer erosion and strip voids. An obvious polar effect is observed during the dissolution of Cu pads on the substrate side and the Ni layer on the Cu pillar side. When Cu pad is located at the cathode, the direction of electron flow is the same as that of the heat flow, and it can accelerate the consumption of Cu pad and the growth of Cu3Sn. When Ni layer serves as the cathode, the electron flow can enhance the consumption of Ni layer. Under 150°C and 2.5104 A/cm2, the local Ni barrier layer is eroded after 2.5 h, which results in the transformation of Cu pillar on the Ni side into (Cux, Niy)6Sn5 and Cu3Sn alloy. The life of Cu pillar interconnection complies well to the 2-parameter Weibull distribution with a shape parameter of 7.78, which is a typical characteristic of cumulative wear-out failure. The results show that the intermitallic growth behavior and failure mechanism at Cu pillar interconnects are significantly accelerated and changed under thermoelectric stresses compared with the scenario under the single high temperature stress.

Influence of Aging Temperature and Time on the Intermetallic Reaction in 15μm Cu/Sn Copper Pillar Bump

Influence of Bump Diameter on the Growth of Intermetallic Compounds in Cu/Ni/Sn Copper Pillar Bump During Aging Process

Investigation of the Intermetallic Compounds Growth in 10μm Cu/Sn and Cu/Ni/Sn Microbumps under Isothermal Temperature Aging

Influence of Solder Cap Thickness on the Interfacial Reaction in Cu/Sn/Ni Copper Pillar Bump

Effect of Sn Surface Diffusion on Growth Behaviors of Intermetallic Compounds in Cu/ni/snag Microbumps

Investigation on Solid State Bonding and Intermetallic Compounds Reaction of Cu Pillar Bump/ni Micro Cones

Effect of Ag on IMC Growth and Shear Strength of Sn-3.5Ag/Cu Microbumps

Research on the Reliability of Cu/Sn Copper Pillar Bump

Research on the Interfacial Reaction and Mechanism of Cu/Sn/Ni Copper Pillar Bump

Role of Cu microstructure during isothermal aging of Cu/Sn/Cu micro solder joints

An Effective Method to Retard Cu–Sn Intermetallic Compounds Formation on the Sidewall of Microbumps by Thermal Oxidation

Crystallographic Changes and Mechanical Performances of SnAg2.4/Cu Pillars During Thermal Shocks in a Large Temperature Range

Interfacial reaction and failure mechanism of Cu/Ni/SnAg1.8/Cu flip chip Cu pillar bump under thermoelectric stresses

Growth Behavior of Ni-Sn Intermetallic Compounds in Microbumps During Long-Term Aging Process

Growth of Cu-Sn intermetallic compounds during isothermal aging processing in electroplated Cu/Sn/Cu system

Microstructure Evolution and Mechanical Properties of Cu/Sn/Ag TLP-bonded Joint During Thermal Aging

Effect of High Temperature Thermal Aging on Microstructural Evolution of Sn3Ag0.5Cu/Cu Solder Joints

Growth kinetics of (Cu<sub>x</sub>Ni<sub>1-x</sub>)<sub>6</sub>Sn<sub>5</sub> intermetallic compound at the interface of mixed Sn63Pb37/SAC305 BGA solder joints during thermal aging test

Solid-state growth kinetics of intermetallic compounds in Cu pillar solder flip chip with ENEPIG surface finish under isothermal aging

Interfacial Reaction and IMCs Growth Behavior of Sn3Ag0.5Cu/Ni Solder Bump During Aging at Various Temperatures

A Cu/Ni/Cu/Sn1.8Ag Microbump Structure for Void-free Interface under Long Time High-Temperature Storage