Abstract:Microbumps play a crucial role in interlayer interconnections for advanced packaging. Among the prevalent microbump structures are Cu/Sn and Cu/Ni/Sn configurations. However, as the bump size continues to shrink, excessive Kirkendall voids tend to form in Cu/Sn microbumps, leading to potential reliability issues. While Cu/Ni/Sn structures can suppress Kirkendall void formation, Ni3Sn4 intermetallic compound (IMC) exhibits inferior physical properties compared to Cu3Sn and Cu6Sn5. In this study, a novel Cu/Ni/Cu/Sn1.8Ag (CNCT) Sn-rich microbump structure with controlled Cu thickness is proposed to suppress Kirkendall void formation while promoting Cu6Sn5 and Cu3Sn as interfacial IMCs. A Ni barrier layer is inserted to partition the Cu pillar and impede Cu atom replenishment from the bottom side. The remaining Cu pillar at the top is designed to be 3μm thick, which is intended to be fully consumed by 8μm Sn1.8Ag solder while simultaneously serving as redundant protection for the bottom Cu pillar against unexpected Sn spillage. The effects of high temperature storage (HTS) at 150°C on IMC evolution in CNCT microbump bonding were investigated for 1500hours. No significant voids were observed at the bonding interface during HTS. Interfacial positions recorded from 0 to 500hours show that the Cu3Sn IMC grows unidirectionally toward the Cu side but not toward the Sn side, indicating a greater diffusion flux of Sn atoms compared to Cu atoms. The diffusion coefficients of Cu in Cu3Sn (DCu,ε), Cu6Sn5 (DCu,η), and Sn in Cu3Sn (DSn,ε), Cu6Sn5 (DSn,η) at 150°C were calculated as 1.36×10-18m2/s, 5.01×10-19m2/s, 9.53×10-19m2/s and 1.10×10-18m2/s, respectively. The dramatic decrease of DCu,η suggests that the diffusion capacity of Cu atoms into Sn is significantly suppressed. The notable transformation of Cu3Sn to Cu6Sn5 occurred after 500hours. By 1500hours, Cu3Sn was greatly consumed, and the bonding interface tended to form a stable Cu/Ni/Cu6Sn5/Ni/Cu structure. Diffusion models were established and discussed to elucidate the mechanisms governing both stages.

An Effective Method to Retard Cu–Sn Intermetallic Compounds Formation on the Sidewall of Microbumps by Thermal Oxidation

A Facile and Novel Method to Retard Intermetallic Compounds Formation by Inserting Cu3Sn Interlayer

Effect of Sn Surface Diffusion on Growth Behaviors of Intermetallic Compounds in Cu/ni/snag Microbumps

Investigation of the Intermetallic Compounds Growth in 10μm Cu/Sn and Cu/Ni/Sn Microbumps under Isothermal Temperature Aging

A Cu/Ni/Cu/Sn1.8Ag Microbump Structure for Void-free Interface under Long Time High-Temperature Storage

Growth Behavior and Morphology of Sidewall Intermetallic Compounds in Cu/Ni/sn-Ag Microbumps During Multiple Reflows

Interfacial Reactions And Reliability Of Sn-Zn-Bi-Xcr Solder Joints With Cu Pads

Effect of the Cross-Interaction on the Formation and Evolution of Intermetallic Compounds in Cu(Ni)/Sn-Ag-Cu/Cu(Ni) Bga Structure Solder Joints

Influence of Aging Temperature and Time on the Intermetallic Reaction in 15μm Cu/Sn Copper Pillar Bump

Formation and Growth of Intermetallic Compounds of Sn-2Ag-2.5Zn on Cu and Ni Substrates

Growth Behavior of Interfacial Cu–Sn Intermetallic Compounds of Sn/Cu Reaction Couples During Dip Soldering and Aging

Grain modification and formation of tough IMC phase in submicron Sn–Ag microbumps via doping Zn and Ni in Cu substrate

Surface protrusion induced by inter-diffusion on Cu-Sn micro-pillars

Effect of Ag on IMC Growth and Shear Strength of Sn-3.5Ag/Cu Microbumps

Self-Healing of Kirkendall Voids and IMC Growth in the Interfacial Reaction of Novel Ni/Cu Bi-Layer Barrier and Solder

Solid-state Interfacial Reaction of Eutectic Sn3.5Ag and Pure Tin Solders with Polycrystalline Cu Substrate

Formation Mechanism of Novel Sidewall Intermetallic Compounds in Micron Level Sn/Ni/Cu Bumps

Suppression Effect of Cu and Ag on Cu 3 Sn Layer in Solder Joints

Investigation of Intermetallic Compound and Voids Growth in Fine-Pitch Sn–3.5Ag/Ni/Cu Microbumps

Effects of Cu Addition on Growth of Au-Sn Intermetallics at Sn-xCu/Au Interface During Aging Process

Role of Cu microstructure during isothermal aging of Cu/Sn/Cu micro solder joints