Heat Transfer Performance Testing of a New Type of Phase Change Heat Sink for High Power Light Emitting Diode

Jian-hua Xiang,Chun-liang Zhang,Chao Zhou,Gui-yun Liu,Wei Zhou
DOI: https://doi.org/10.1007/s11771-018-3862-0
2018-01-01
Journal of Central South University
Abstract:In view of the limitations of solid metal heat sink in the heat dissipation of high power light emitting diode (LED), a kind of miniaturized phase change heat sink is developed for high power LED packaging. First, the fabrication process of miniaturized phase change heat sink is investigated, upon which all parts of the heat sink are fabricated including main-body and end-cover of the heat sink, the formation of three-dimensional boiling structures at the evaporation end, the sintering of the wick, and the encapsulation of high power LED phase change heat sink. Subsequently, with the assistance of the developed testing system, heat transfer performance of the heat sink is tested under the condition of natural convection, upon which the influence of thermal load and working medium on the heat transfer performance is investigated. Finally, the heat transfer performance of the developed miniaturized phase change heat sink is compared with that of metal solid heat sink. Results show that the developed miniaturized phase change heat sink presents much better heat transfer performance over traditional metal solid heat sink, and is suitable for the packaging of high power LED.
What problem does this paper attempt to address?