Optimization of Heat Sink Encapsulated with Phase Change Material for High Temperature Ambient

LU Tao,JIANG Pei-Xue,DENG Jian-qiang
DOI: https://doi.org/10.3969/j.issn.1005-9490.2005.03.002
2005-01-01
Abstract:Heat sink encapsulated with phase change material for high temperature environment absorbs heat from electronic devices and high temperature ambient. The geometry of heat sink has great influence on heat transfer. Optimization of the geometry of heat sink involves determination of the fin length, the fin thickness, the base width and the base thickness that maximizes the time before the base of heat sink reaches a critical temperature with the constraint conditions of whole size of heat sink, boundary conditions, fin material, and phase change material. The optimization values of the four parameter mentioned above, which give attention to two aspects both the efficiency of heat transfer and the capability of heat storage, are obtained through numerical simulation of heat transfer. The heat transfer is also analyzed in the process of optimization.
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