Heat Transfer of Heat Sink Encapsulated with Phase Change Material to Prevent Temperature from Rising for Electronic Devices

LU Tao,JIANG Pei-Xue
DOI: https://doi.org/10.3969/j.issn.1005-9490.2005.02.001
2005-01-01
Abstract:A huge amount of heat is generated due to increase electric current. Thermal storage system with solid-liquid phase change is used to keep temperature of the electronic device stable; thereby the goal of protection from high temperature is achieved. Theoretical analysis of heat transfer of heat sink encapsulated with phase change material (PCM) under the cooling of natural convection is completed. The average temperature of heat sink, PCM, and air and the process of phase change of PCM are obtained. The time of protection from high temperature and the characteristic of convective heat transfer are analyzed contrastively under different heat flux for the same heat sink and cooling condition.
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