New Development of Technical Research on Heat-Release Package of High-Power LEDs

Demiao Wang
IF: 5.967
2007-01-01
IEEE Transactions on Power Electronics
Abstract:How to improve the heat-sinking capability is one of the key technical problems for the package and appli-cation design of device concerned with high-power LEDs.The present technical research on heat-release package of high-power LEDs is analyzed,and the trend is summarized.Besides,it suggests that reducing the internal heat sink may be one of the developments in the future.
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