Defects Detection for Flip Chip Using Modal Analysis

ZENG Miao,LIAO Guang-lan,ZHANG Xue-kun,LIU Jun-chao,SHI Tie-lin
DOI: https://doi.org/10.3969/j.issn.1000-3835.2013.06.005
2013-01-01
Abstract:Flip chip is becoming one of the mainstream technologies in microelectronic packaging,and the quality inspection of flip chip is being gained more and more attention.The solder bump missing,a typical defect in flip chip,was concerned.The vibration equation of flip chip was deduced based on a special vibration model.The influence of defects on the vibration response was described,and the principle of defects inspection for flip chip using modal analysis was presented.The influence of solder bumping missing on the variation of natural frequencies of flip chip used in experiments was calculated.Then,the shifting of the natural frequencies of the referencial flip chip and flip chips containing defects was numerically simulated and also measured in experiments.The results validate the correctness of the analytic model,indicating that the solder bump missing of flip chip can be detected using modal analysis,and the inspection technique can be satisfactoryly used to detect defects of flip chips.
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