Thermal Stress Behavior of Diffusion-Bonded Sic/6061al Laminates During Thermal Cycling

H Li,JB Li,ZG Wang,CH Jiang,DZ Wang
2009-01-01
Abstract:The thermal stress behavior of bonded SiC/6061AL laminates during thermal cycling and the stress relaxation at elevated temperature (205 degrees C) were investigated by means of X-ray diffraction. It was found that the elastic and elastoplastic deformation in the 6061Al layer took place during thermal cycling, and the same closed stress temperature loop was formed in the second cycling for the aged and low temperature treated specimen. Meanwhile, it was demonstrated that the compressive stress relaxed in 6061Al layer at 205 degrees C within the range of 0.5 similar to 16 h, and which was nearly unchanged with further prolongation of time.
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