Effect of Hydrogen Addition on Diffusion Bonding Behavior of Ti-55 Alloy

Huiping Wu,Heli Peng,Xifeng Li,Jun Chen
DOI: https://doi.org/10.1016/j.msea.2018.10.032
2019-01-01
Abstract:The mechanism of hydrogen-induced void closure during diffusion bonding (DB) process of hydrogenated Ti-55 alloy with different hydrogen contents at different temperatures has been investigated. When bonded at 700 degrees C, bonding ratio and shear strength prominently improve with the increase of hydrogen content, which results from residual hydrogen in bonded sample. Hydrogen can increase the fractions of high angle grain boundaries (HAGBs) and beta phase as well as break up original long-strip alpha grains. However, hydrogen almost escapes from hydrogenated alloy when bonded at 800 degrees C. Then bonding ratio and shear strength slightly increase with increasing hydrogen content. It attributes to grain refinement and volume fraction increase of beta phase. Therefore, residual hydrogen plays a key role in improving diffusion bonding properties during DB process.
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