Improvement of Contact Resistance Between Each Silver Nanowire and Thermal Stability of Silver Nanowire Transparent Electrodes by Electrodeposition

Jiseong Jang,Deok-Yong Park,Ki-Ha Hong,Soomin Song,Kihwan Kim,Young-Joo Eo,Jihye Gwak,Jae Ho Yun,Choong-Heui Chung
DOI: https://doi.org/10.1166/nnl.2018.2671
2018-01-01
Nanoscience and Nanotechnology Letters
Abstract:Solution-processed silver nanowires are promising materials as transparent electrodes for optoelectronic devices to indium tin oxide thin film. For application to various devices, the sheet resistance of silver nanowire networks must be reduced further and thermal stability of the silver nanowire networks should be improved. By lowering the contact resistance between the nanowires, the sheet resistance of the silver nanowire networks can be further lowered. In this work, we improve the electrical conductivity as well as thermal stability of silver nanowire networks by the electrodeposition of silver. The electrical and optical properties are readily controlled by adjusting the electrodeposition time. The sheet resistance of silver nanowire networks is decreased by welding between each silver nanowire. The thermal stability of silver nanowire networks is improved by controlling the diameter of the silver nanowires.
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