Quantitative model for grain boundary effects on strength-electrical conductivity relation
Jiapeng Hou,Xiaotao Li,Shuo Wang,Xueyuan Fan,Chenghui Li,Qiang Wang,Zhenjun Zhang,Zhefeng Zhang
DOI: https://doi.org/10.1016/j.actamat.2024.120390
IF: 9.4
2024-09-16
Acta Materialia
Abstract:Fine-long shaped grains have been proved to be an efficient design approach to overcome the traditional trade-off relation between strength and electrical conductivity (EC) of metal wires. However, quantitative models linking grain shape parameters to both strength and EC remain scarce, limiting the precise optimization of material properties. In this study, grain boundaries (GBs) were classified into parallel or perpendicular ones to establish the quantitative models. Accordingly, a novel model for calculating the EC of fine-long shaped grains was proposed by first parallel-connecting the parallel GBs with the matrix, then series-connecting them with the vertical GBs. The EC calculated using this new model shows a small error band of only 0.5 %, indicating an excellent accuracy of EC calculation. Besides, a quantitative model for calculating the strength based on grain width was also developed. Consequently, the general effects of grain shape parameters including grain width, grain length, grain volume and grain aspect ratio on the strength and EC were quantitatively revealed. This work does not only advance the principle for achieving high strength and high EC through fine-long shaped grains from a qualitative concept to a quantitative framework but also offers valuable insights for the quantitative analysis of GB effects on strength and EC in other materials.
materials science, multidisciplinary,metallurgy & metallurgical engineering