A Transition Beween Single-Layer Substrate Integrated Image Guide and Coaxial Probe

Meng Tian Mu,Yu Jian Cheng
DOI: https://doi.org/10.1109/csqrwc.2018.8455479
2018-01-01
Abstract:The substrate integrated image guide (SIIG) is a planar transmission line with low-loss and high-Q properties. To reduce the fabrication complexity, the SIIG realized by the single-layer PCB technology is introduced. The differences between this type of SIIG and the conventional one are analyzed. A feasible method is proposed to minimize the additional leakage loss caused by the single-layer PCB process and achieve the similar performance compared with the conventional SIIG. A SIIG line working from 13.2GHz to 14.8GHz is designed utilizing this method. Then, a single-layer transition from a coaxial probe to the SIIG is presented. A 132.2 mm long single-layer PCB-based SIIG with such a transition is designed and fabricated. The measured results show that insertion loss is better than 4.25dB while the return loss is under -10dB from 13.2 GHz to 14.8 GHz.
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