Towards Atomic-Scale Fabrication in Silicon

Bethany M. Hudak,Stephen Jesse,Jiaming Song,Albina Borisevich,Paul C. Snijders,Sergei V. Kalinin,Andrew R. Lupini
DOI: https://doi.org/10.1017/s1431927618001289
IF: 4.0991
2018-01-01
Microscopy and Microanalysis
Abstract:The advance of modern technology requires the ability to produce ever-shrinking devices, in some cases reaching atomic scales or relying on quantum effects. This demand for quantum devices requires fabrication on the atomic scale to guarantee precise control of crystalline layers, active dopant placement, and to avoid or understand atomic-scale defects. However, current techniques for nanoscale fabrication in the semiconductor industry lack the capability to fabricate on the atomic scale. The current state of the art in atomic fabrication includes the positioning of single atoms [1] and surface lithography [2] using scanning tunnelling microscopy (STM) and atomic force microscopy (AFM) on twodimensional surfaces [3,4], but an active quantum device would require sub-surface dopant positioning [5]. For the development of quantum devices, these techniques are limited in two ways: 1) There is still a need for atomic-scale fabrication of ancillary structures, and 2) The atomic manipulation is limited to surfaces. For quantum fabrication, the goal is to construct semiconductor devices with atomic-layer precision and to control the placement of active subsurface dopants. Scanning transmission electron microscopy (STEM) has recently been demonstrated as a technique for the epitaxial growth of material at a crystalline-amorphous (CA) interface [6,7]. Here we show the ability to crystallize, amorphize, remove material, and direct dopants, which form important steps toward quantum device fabrication.
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