Low Leakage Current Resistive Memory Based on Bi-1.10 (fe0.95mn0.05) O-3 Films

Zhen Li,Zhengchun Yang,Jiagang Wu,Baozeng Zhou,Qiwen Bao,Kailiang Zhang,Jinshi Zhao,Jun Wei
DOI: https://doi.org/10.1088/1361-6641/aad340
IF: 2.048
2018-01-01
Semiconductor Science and Technology
Abstract:The bipolar resistance switching characteristics were confirmed in a resistive memory device with an Ag/Bi-1.10(Fe0.95Mn0.05)O-3/SRO/Pt/TiO2/SiO2/Si(100) structure, in which the limiting current was 1 mA. In comparison with BiFeO3-based memory, it was found that doping with Mn effectively reduced the leakage current of the device and thus improved the device endurance (200 cycles-1000 cycles). The high-temperature retention test demonstrated that the device could be used for 10 years without losing data. Through x-ray photoelectron spectroscopy analysis of Bi-1.10(Fe0.95Mn0.05) O-3 thin film elements, it was inferred that both the oxygen vacancies, which are produced by high-temperature conditional growth, and the doped Mn change the Fe valence, thereby reducing the leakage current. Finally, through fitting analysis of the I-V diagram and temperature tests in the low-resistance state, we inferred that the behavior of the resistance conversion is due to the formation of Ag conductive filaments.
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