Abstract:Phase change heat transfer has received extensive attention in the thermal management of electronic devices. Most studies of heat pipe or vapor chamber were limited to one-or two-dimensional heat transfer mode. Enhancing the phase change heat transfer to three-dimensional mode in heat sinks and exploring the thermal behavior of the heat sinks deserve a dedicated study. In this paper, a three-dimensional thermosyphon (3D-TS) heat sink combining the superiorities of the vapor chamber, thermosyphon and folded fins was experimentally investigated. The experimental reliability was validated and consolidated by the heat loss analysis, and an iteration method was proposed to estimate the saturation temperature to facilitate the in-depth analysis of the results. The coupling characteristics of the air forced convection and phase change heat transfer, and the effects of the heating power and air volume flow rate on the thermal resistance of 3D-TS were involved in the discussion. The main results indicate that the overall thermal resistance exhibits a negative correlation with the heating power and the air volume flow rate. The lowest thermal resistance of 0.14 K.W- 1 was achieved with Qtotal = 300 W and 100 CFM air volume flow rate. High temperature on the folded fins indicates that the phase change heat transfer extends from the flat vapor chamber to the vertical thermosyphon tubes. It is also found that for a small heating power, a relatively large air volume flow rate is not able to further reduce the overall thermal resistance due to inadequate phase change intensity. The proposed heat sink is expected to solve the heat dissipation problems for densely packed electronic devices, which can produce favorable performance according to the input heating power and appropriate air volume flow rate.

Investigation of the Thermal Performance of a Novel Flat Heat Pipe Sink with Multiple Heat Sources

Experimental Investigation of the Thermal Performance of Flat Heat Pipe Heat Sink for Multi-chip Cooling

Experimental Investigation of the Thermal Performance of a Heat Sink with U-shaped Heat Pipes

An experimental study of a novel integrated heat pipe-heat sink for chip cooling

Experimental investigation on thermal performance of a flat heat pipe

Thermal Performance of a Novel Flat Heat Pipe with Integral Micro-Grooved Wick for Energy Saving

Experimental Studies on a Novel Thin Flat Heat Pipe Heat Spreader

An experimental investigation on a novel high-performance integrated heat pipe–heat sink for high-flux chip cooling

Heat transfer and flow performance of a novel T type heat sink with GaInSn coolant

Numerical and Experimental Investigation on Flat Heat Pipes With Integral Micro-grooved Wicks

Experimental Investigation of Heat Transfer Performance for a Novel Microchannel Heat Sink

Experimental and Numerical Investigation on Thermal Characteristics of the Heat Sink Integrating 3D Vapor Chamber Heat Spreader and Liquid Cooling Fins

Experimental Investigation on an Integrated Multiple-Contact FHP Heat Sink

Experimental Investigation of Thermal Performance of a Unique Heat Pipe Array

Three-dimensional numerical investigation of flow and heat transfer performances of novel straight microchannel heat sinks

Experimental Study of an Integrated Aluminum Flat Plate Heat Pipe for Lightweight Thermal Management in Electronic Devices

An experimental study of a novel high-performance heat pipe for chip cooling of desktop computer

An experimental investigation on the thermal performance of a flat plate heat pipe spreader

Experimental Study on the Thermal Characteristics of a 3D Thermosyphon Heat Sink

Experimental investigation on a 0.5-metre-long aluminum flat heat pipe for thermal management in electronic devices

Design of CPU Integrated Heat Sink Using Heat Pipes Assisted with CFD and Experimental Research