Abstract:A two-step methodology is proposed for the design and optimization of liquid-cooled heat sinks, where manufacturing costs are included as a commercial viability assessment metric. First, manifold modifications were made to reduce pressure losses in the baseline design. Second, a full-factorial parametric computational fluid dynamics (CFD) study fed an artificial neural network (ANN) model for further optimization. The aforementioned methodology was applied to the optimization of liquid-cooled heat sinks for CPU cooling. The baseline design consisted of a 3-D printed resin plenum mounted on a metallic heat spreader with parallel fin channels. The plenum delivers a slot jet along the center of the heat sink into a central passage that bifurcates the fin channels. An improved plenum design with ∼11% lower pressure losses than the baseline model was generated after the first optimization step. The designs generated in the parametric CFD study achieved average thermal resistances as low as 0.01 K/W for a theoretical pumping power range of 50–350 mW. A representative design from this study was manufactured and experimentally tested to assess the simulation approach, providing reasonable agreement with the numerical results. Consecutively, the ANN allowed for a higher resolution sampling of the design space, where optimal configurations were found in terms of an overall thermo-hydraulic performance parameter and an additional metric accounting for manufacturing costs. The methodology reported herein caters to heat sink designers seeking commercialization of their prototypes as the contrast between technical performance and manufacturing costs is addressed. Additionally, the mathematical tools utilized allow for cost-effective topology optimizations.

Development and numerical investigation of novel gradient-porous heat sinks

Thermohydraulic Performance Optimization of Integrated Porous Pin Fins in Microchannel Heat Sink Using Shape Optimization Coupled with NSGA

Numerical configuration design and investigation of heat transfer enhancement in pipes filled with gradient porous materials

Numerical investigation on thermal-hydraulic characteristics of the micro heat sink with gradient distribution pin fin arrays and narrow slots

Numerical and experimental investigation of optimized heat sink designs for liquid cooling of a heterogeneous heating surface with multiple heat sources

Numerical study on hydrothermal performance in a microchannel with gradient array of ribs and pin fins

Design and Characterization of Isothermal Chambers Filled with Gradient-Porous Materials

Pore-scale numerical investigation on comprehensive heat transfer performance of homogeneous and graded metal foam heat sinks based on tetrakaidecahedron cell

Topology optimization, additive manufacturing and thermohydraulic testing of heat sinks

Numerical study on hydrodynamic characteristics of plate-fin heat exchanger using porous media approach

Novel thermal design of micro-bream-fin heat sink using contour-extraction-based (CEB) method

Three-dimensional numerical investigation of flow and heat transfer performances of novel straight microchannel heat sinks

Insight into porous fin microchannel heat sinks with improved thermo-hydraulic performance

A Novel Design Method of Heat Sink with Conjugate Heat Transfer by Free-Shape Channel Modeling

Topology optimization of heat sinks for instantaneous chip cooling using a transient pseudo-3D thermofluid model

A new design of double-layered microchannel heat sinks with wavy microchannels and porous-ribs

Experimental investigation of the thermal-hydraulic characteristics of liquid cooling heat sinks with novel pin fins

Experimental and numerical investigation on the heat transfer enhancement for Mini-channel heat sinks with tessellated fins

Numerical Study on Hybrid Discontinuous Microchannel Heat Sink Combining Manifold with Pin Fins (DMC-MPF) for High Power Electronic Device

Liquid-cooled heat sink design methodology with technical and commercial viability considerations: Case study of a partially 3-D printed prototype

Microscale Heat Transfer Enhancement Using Thermal Boundary Layer Redeveloping Concept