Abstract:Ultrasonic wedge bonding of aluminum (Al) wires is a widely applied interconnect technology for power elec-tronic packaging. The joint quality of the wedge bonding is mainly affected by the process parameters and material properties. Inappropriate process parameters will lead to failure modes such as chip surface pit, metal layer peeling off, wire cracking, non-sticking to the pad, etc., which limits the long-term stability of power devices. In order to reach the desired reliability, the design of experiment (DoE) is generally deployed which is costly in terms of time and related materials. Therefore, simulation-assisted analysis is in demand to rapidly narrow down the process windows. In this paper, an ultrasonic bonding model involving thick Al wires (300 mu m) was established based on the Finite Element Method (FEM), to optimize process parameters effectively with reduced time and cost. The model was designed in ANSYS utilizing the transient structural mechanics module with various stresses and ultrasonic power, to simulate the relative deformation of the bonded wires and the displacement against the substrate. The result was then verified by ultrasonic wedge bonding samples with 9 sets of process parameters. The stress distributions were simulated and analyzed with the failure modes of tensile strength tests, while the deformation of wires under various process parameters was measured and compared with shear strength tests. Further, the relationship between the failure modes of the joint and the deformation was then analyzed by Response Surface Method (RSM), and the regression equation of the wire deformation and related process parameters was established and fitted with the actual sample's data. Such analysis not only found the optimum range of the deformation of thick Al ultrasonic wire bonds but also quickly provided a range of optimized processes for Al thick wires applying ultrasonic wedge bonding techniques.

Study EOS of a Gold Wire by Experiments and the Finite Element Analysis

Electro-Thermo-Mechanical Characterizations of Various Wire Bonding Interconnects Illuminated by an Electromagnetic Pulse

Ruggedness Characterization of Bonding Wire Arrays in LDMOSFET-Based Power Amplifiers

Simulation and Experimental Analysis of Thermomechanical Stress Around Interconnects for W2W Hybrid Bonding

Transient Electro-Thermo-mechanical Responses of Wire Bonding Interconnects Illuminated by an Electromagnetic Pulse

EOS Failure Analysis and Die Attach Optimization

Study on Electro-Thermo-Mechanical Responses of Bonding Wires Arrays Used for the Package Design of Ldmosfet-Based Rf Amplifier

Transient Electrothermal Analysis of Multilevel Interconnects in the Presence of ESD Pulses Using the Nonlinear Time-Domain Finite-Element Method

Wear-out Evolution Analysis of Multiple-Bond-wires Power Modules Based on Thermo-Electro-mechanical FEM Simulation

Electro-Thermo-Mechanical Investigation On Multi-Level Interconnects In The Presence Of An Esd Pulse

Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods

Numerical Study of Gold Wire Bonding Process on Cu/Low-k Structures

A Multi-Physics Coupling Analysis to Predict Stress Corrosion Characteristics of Wires in Rope under Wear Damage

Analysis of Broken Wires During Gold Wire Bonding Process

Relating Residual Stress and Microstructure to Mechanical and Giant Magneto-Impedance Properties in Cold-Drawn Co-based Amorphous Microwires

Finite element modeling and analysis of ultrasonic bonding process of thick aluminum wires for power electronic packaging

Stress analysis of interconnect structure in COF by finite element method

Thermo-mechanical Modelling of Cu Wire Parallel Gap Micro-resistance Welding Process

Finite element simulation analysis for electrostrictive strain of dielectric elastomer

Experiments and reliability research on bonding process of micron copper wire and nanometer gold layer

Stress Concentration Effect in Interface Between Conductor and Epoxy Resin in Coaxial Components of Power Equipment