Abstract:With the introduction of lead-free solder alloys, the effect of voids on solder joint reliability has rapidly gained importance. In this study, a first analysis of X-rayed CR0805 solder joints shows a significant reduction in void content, from 20% down to 2.5%, after vacuum soldering. The statistical analysis of the void distribution demonstrates that the vacuum option reduces number of voids and median diameter of voids in comparison to the convection soldering process. A subsequent accelerated thermal cycling test of these analysed test vehicles, according to JESD22-A104D, indicates the tendency of a higher characteristic life time for higher void content. In contrast to these findings, the 1% to failure criterion reveals a higher reliability for lower voiding. During the finite element method (FEM) modelling part of this study, two modelling approaches of void implementation into solder joint geometry are investigated: modelling with a constant volume of the standoff for different void contents, and a modelling approach with a random combination of void content and volume of standoff. The modelling approach with the random combination reveals that voids can reduce the lifetime in the “worst case” parameter combination. In particular, the 1% time to failure rate indicates a quantitative correlation with the experimental results. Furthermore, the FEM results suggest a higher impact on reliability for a single void in comparison to a distribution of multiple voids with similar void content. Finally, the FEM study shows a high sensitivity of predicted life time with respect to the standoff height. Based on this finding, the CR0805 solder joint geometry is examined using optical inspection and cross-section polishes with the outcome that the better wetting behaviour during vacuum soldering causes a reduction of the solder alloy volume and consequently further decreases the standoff height.

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Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints

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VISCOPLASTIC-DAMAGE CONSTITUTIVE MODEL COUPLED WITH VOID EFFECTS FOR Pb/Sn SOLDER ALLOYS

Mechanical Properties and Parameter Determination of Anand Viscoplastic Constitutive Model for Pb-free Solder Alloys

Void formation at the interface in Sn/Cu solder joints.

Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface

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Robust Tuning of Kirkendall Void Density in Circuit Interconnections Through Substrate Strain Annealing

The Effect Of Voids On Thermal Conductivity Of Solder Joints

Coupled Phase Field And Finite Element Modeling Of Void Evolution And Physical Property Change Of Micro Flip-Chip Solder Joints Under Electromigration And Elastic Stress Field

Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies

Suppression of Void Nucleation in Sn3.0Ag0.5Cu/CU Solder Joint by Rapid Thermal Processing

Effects of Current Density and Concentration of Sn2+ on Solder Voids

Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability

Experimental Study of Void Formation in Eutectic and Lead-Free Solder Bumps of Flip-Chip Assemblies

Study of the Formation of Copper Void Defect and Process Optimization For Reduction In Dual Damascene Process

Effect of Substrates on the Formation of Kirkendall Voids in Sn/Cu Joints

Mechanical property and void ratio of several Pb-containing and Pb-free solder joints in space power electronics

Relationship between morphologies and orientations of Cu6Sn 5 grains in Sn3.0Ag0.5Cu solder joints on different Cu pads