Abstract:The past decade has seen increasing attention to Cu-Sn solid-liquid interdiffusion (SLID) bonding technology, which can be applied to achieve bonding at a low temperature and the bonded interconnect (joint) is capable of withstanding high service temperatures. However, due to different diffusion rates between Cu and Sn atoms, Kirkendall voids arise in interfacial intermetallic compound (IMC) layers, then crack may initiate in the region with large Kirkendall voids near the Cu/IMC interface, which has become a serious concern for the SLID bonding technology. In the present work, the propagation behavior of crack caused by voids at the Cu/Cu3Sn interfaces is studied by three-dimensional (3D) finite element analysis via virtual crack closure technique (VCCT). By calculating fracture mechanics parameters (such as energy release rate, G) at the crack tip, the influence of Kirkendall void distribution and different phase thicknesses in the solder joint on the tendency of crack propagation is investigated. The effects of crack length and temperature on fracture propagation tendency are also studied. The simulation results manifest that crack at the interface of Cu/Cu3Sn is more likely to propagate than inside intermetallic compound (Cu3Sn) layer. Moreover, a void-type crack has a higher energy release rate than an interfacial crack. The average value of G increases significantly with expansion of the void area, while G(max) tends to decrease at the crack tip. The increase in thickness of both Cu3Sn and Cu6Sn5 layers promotes the propagation of crack. Besides, the thickness of Cu layer also influences crack propagation greatly. G(max) increases with increasing thickness of Cu (UBM) layer from 0.5.m to 1.1.m, while decreasing rapidly as Cu layer continues to thicken.

Effect of Substrates on the Formation of Kirkendall Voids in Sn/Cu Joints

Forming Mechanism and Growth of Kirkendall Voids of Sn/Cu Joints for Electronic Packaging: A Recent Review

Fine Grained Cu Film Promoting Kirkendall Voiding at Cu3Sn/Cu Interface

Effects of Current Stressing on Formation and Evolution of Kirkendall Voids at Sn–3.5Ag/Cu Interface

Effect of Deposit Thickness During Electroplating on Kirkendall Voiding at Sn/Cu Joints

Void formation at the interface in Sn/Cu solder joints.

Relation Between Kirkendall Voids and Intermetallic Compound Layers in the SnAg/Cu Solder Joints

Evolution Modes and Self-healing Phenomenon of Kirkendall Voids at the Sn/Cu Solder Joints

Effect of Zn on formation of voids on SnxZn/Cu interface

Interface Growth and Void Formation in Sn/Cu and Sn0.7Cu/Cu Systems

Finite Element Simulation Study of the Effects of Kirkendall Voids in IMC Layer on Interfacial Crack and Reliability of Cu–Sn Solder Joint

Phase-Field Crystal Simulation on Evolution and Growth Kinetics of Kirkendall Voids in Interface and Intermetallic Compound Layer in Sn/Cu Soldering System

Phase field simulation of Kirkendall voids at the interface of microscale Sn/Cu system lead-free interconnects

Effect of Electroplated Current Density on Voids at Sn/ElectroplatedCu Joint Interface

Role of Cu microstructure during isothermal aging of Cu/Sn/Cu micro solder joints

Understanding and preventing Cu–Sn micro joint defects through design and process control

Suppression of Cu3Sn and Kirkendall Voids at Cu/Sn-3.5Ag Solder Joints by Adding a Small Amount of Ge

Effects of Sn Layer Orientation on the Evolution of Cu/Sn Interfaces

Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints

Electromigration-induced Intermetallic Growth and Voids Formation in Symmetrical Cu/Sn/Cu and Cu/Intermetallic Compounds (imcs)/cu Joints

The Effect of Pressure and Orientation on Cu-Cu3Sn Interface Reliability under Isothermal Ageing and Monotonic Traction Via Molecular Dynamics Investigation