Abstract:The demands for high density, fine pitch interconnections in electronics systems has seen solder-based approaches for such interconnections miniaturized to the scale of tens of micro meters. At such a small scale, such 'micro joints' may contain only one or a few grains and the resultant mechanical behaviour may not be that for a polycrystalline aggregate, but rather for a single crystal. Since the ~-Sn matrix of SnAgCu solder has a contracted body-centred tetragonal (BCT) structure, such a solder grain is expected to demonstrate a considerably anisotropic behaviour. In such cases the reliability of a Phfree solder is strongly dependent on the local microstructural features, such as the size and orientation of the grains. This thesis presents the investigation of the evolution of microstructure within a joint or at the interface and, the influence of such microstructural features on the meso-scale mechanical behaviour of the Ph-free solder. It includes Evolution of the interface between a molten solder and the Cu substrate To form a joint, the solder alloy is heated and molten, wetting a solid under-bump metallization. After solidification, layers of brittle intermetallic compounds (IMCs) are formed at the interface. In this project, facilities were set up to obtain interfacial reactants at an arbitrary moment of the liquid/solid reaction. Formation and evolution ~ during reflow of SnCu IMCs at the interface between the molten SnAgCu alloy and the Cu UBM was captured and presented for the first time. Formation of phases and IMCs with the body of a liquid SnAgCu solder during solidification The formation behaviour of basic components for a SnAgCu grain (including Sn dendrites, AIDSn and Cu6Sns IMCs) during solidification was investigated. Relationships between the growth behaviour of these components and their internal lattice orientation were studied. The characteristic growth and coupling of AIDSn IMCs and the Sn matrix to form eutectics has been elaborated and presented in this study for - 1- the first time. Based on the results, the forming process of a eutectic SnAgCu grain under the non-equilibrioum solidification condition was illustrated; and major factors that determine the lattice-orientation, size and substructure of the grain were discussed. Meso- and Micro- scale mechanical behaviour of a SnAgCu solder joint To study the size effect on the microstructure, and subsequently, the meso-scale · mechanical behaviour, solder joints were manufactured with varying geometries. Shearing tests were performed·on these meso-scale joints. The results first demonstrated that the anisotropic characteristics of a SnAgCu grain play an important role in the mechanical behaviour of both a meso-scale solder joint and the adjacent interfacial IMCs. To further investigate the micro-scale deformation and damage mechanisms, micro-mechanical tests were preformed within a SnAgCu grain. Constitutive equations for a SnAgCu grain Based on the experimental results, a crystal model was established to describe the local microstructure-dependent mechanical behaviour. The constitutive equation was implemented by means of the finite element approach, and applied in solder joints of a Flip Chip (FC) package by a multi-scale method. To describe the crystal behaviour at the higher temperature, the model was improved to account for deformations due to vacancy diffusion and thermal expansion. This model was integrated by an implicit approach, and implemented in a full three dimension (3D) finite element (FE) model.

Understanding and preventing Cu–Sn micro joint defects through design and process control

Forming Mechanism and Growth of Kirkendall Voids of Sn/Cu Joints for Electronic Packaging: A Recent Review

Role of Cu microstructure during isothermal aging of Cu/Sn/Cu micro solder joints

Effect of Substrates on the Formation of Kirkendall Voids in Sn/Cu Joints

Void Growth and Intermetallic Bridging in Microscale Solder Interconnects Under Thermal Annealing

Electromigration-induced Intermetallic Growth and Voids Formation in Symmetrical Cu/Sn/Cu and Cu/Intermetallic Compounds (imcs)/cu Joints

Finite Element Simulation Study of the Effects of Kirkendall Voids in IMC Layer on Interfacial Crack and Reliability of Cu–Sn Solder Joint

Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer

Enhanced reliability of Cu-Sn bonding through the microstructure evolution of nanotwinned copper

Relation Between Kirkendall Voids and Intermetallic Compound Layers in the SnAg/Cu Solder Joints

Interface Growth and Void Formation in Sn/Cu and Sn0.7Cu/Cu Systems

Phase field simulation of Kirkendall voids at the interface of microscale Sn/Cu system lead-free interconnects

Microstructural Features and Mechanical Behaviour of Lead Free Solders for Microelectronic Packaging

Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface

Effect of Deposit Thickness During Electroplating on Kirkendall Voiding at Sn/Cu Joints

Effects of initial Cu grain size and impurity residues on the liquid phase reactions between molten solder and electroplated Cu

Impacts of temperature gradient on microstructure and properties of Cu/ Sn58Bi-0.6B4C NPs/Cu joints fabricated by vacuum thermal compression bonding

Microstructures and Mechanical Properties of Cu/Sn/Cu Structure Ultrasonic-TLP Joint

Crystallographic Structure and Mechanical Behaviour of SnAgCu Solder Interconnects under a Constant Loading Rate

Low Cycle Fatigue Reliability and Interfacial Reaction of Lead-free Solder Joints for Electronic Packaging

Impacts of Temperature Gradient on Microstructure and Properties of Cu/Sn58Bi-0.6B4C NPs/Cu Joints Fabricated by Vacuum Thermal Compression Bonding