Abstract:The demands for high density, fine pitch interconnections in electronics systems has seen solder-based approaches for such interconnections miniaturized to the scale of tens of micro meters. At such a small scale, such 'micro joints' may contain only one or a few grains and the resultant mechanical behaviour may not be that for a polycrystalline aggregate, but rather for a single crystal. Since the ~-Sn matrix of SnAgCu solder has a contracted body-centred tetragonal (BCT) structure, such a solder grain is expected to demonstrate a considerably anisotropic behaviour. In such cases the reliability of a Phfree solder is strongly dependent on the local microstructural features, such as the size and orientation of the grains. This thesis presents the investigation of the evolution of microstructure within a joint or at the interface and, the influence of such microstructural features on the meso-scale mechanical behaviour of the Ph-free solder. It includes Evolution of the interface between a molten solder and the Cu substrate To form a joint, the solder alloy is heated and molten, wetting a solid under-bump metallization. After solidification, layers of brittle intermetallic compounds (IMCs) are formed at the interface. In this project, facilities were set up to obtain interfacial reactants at an arbitrary moment of the liquid/solid reaction. Formation and evolution ~ during reflow of SnCu IMCs at the interface between the molten SnAgCu alloy and the Cu UBM was captured and presented for the first time. Formation of phases and IMCs with the body of a liquid SnAgCu solder during solidification The formation behaviour of basic components for a SnAgCu grain (including Sn dendrites, AIDSn and Cu6Sns IMCs) during solidification was investigated. Relationships between the growth behaviour of these components and their internal lattice orientation were studied. The characteristic growth and coupling of AIDSn IMCs and the Sn matrix to form eutectics has been elaborated and presented in this study for - 1- the first time. Based on the results, the forming process of a eutectic SnAgCu grain under the non-equilibrioum solidification condition was illustrated; and major factors that determine the lattice-orientation, size and substructure of the grain were discussed. Meso- and Micro- scale mechanical behaviour of a SnAgCu solder joint To study the size effect on the microstructure, and subsequently, the meso-scale · mechanical behaviour, solder joints were manufactured with varying geometries. Shearing tests were performed·on these meso-scale joints. The results first demonstrated that the anisotropic characteristics of a SnAgCu grain play an important role in the mechanical behaviour of both a meso-scale solder joint and the adjacent interfacial IMCs. To further investigate the micro-scale deformation and damage mechanisms, micro-mechanical tests were preformed within a SnAgCu grain. Constitutive equations for a SnAgCu grain Based on the experimental results, a crystal model was established to describe the local microstructure-dependent mechanical behaviour. The constitutive equation was implemented by means of the finite element approach, and applied in solder joints of a Flip Chip (FC) package by a multi-scale method. To describe the crystal behaviour at the higher temperature, the model was improved to account for deformations due to vacancy diffusion and thermal expansion. This model was integrated by an implicit approach, and implemented in a full three dimension (3D) finite element (FE) model.

Void Growth and Intermetallic Bridging in Microscale Solder Interconnects Under Thermal Annealing

Electromigration-induced Intermetallic Growth and Voids Formation in Symmetrical Cu/Sn/Cu and Cu/Intermetallic Compounds (imcs)/cu Joints

Study on the Interfacial IMCs Growth of Nt-Cu/in Solder Joints

Growth kinetics of (Cu<sub>x</sub>Ni<sub>1-x</sub>)<sub>6</sub>Sn<sub>5</sub> intermetallic compound at the interface of mixed Sn63Pb37/SAC305 BGA solder joints during thermal aging test

Diffusion-controlled growth of phases in metal-tin systems related to microelectronics packaging

The In-Situ TEM Isothermal Aging Evolution in a μ-Cu/NiAu/Sn/Cu Solder Joint for Full Intermetallic Compounds Interconnects of Flexible Electronics

Investigation of the Intermetallic Compounds Growth in 10μm Cu/Sn and Cu/Ni/Sn Microbumps under Isothermal Temperature Aging

Microstructural Evolution of the Intermetallic Compounds in the High Density Solder Interconnects with Reduced Stand‐off Heights

Microstructural Features and Mechanical Behaviour of Lead Free Solders for Microelectronic Packaging

Interfacial Intermetallic Compound Growth in Sn-3Ag-0.5Cu/Cu Solder Joints Induced by Stress Gradient at Cryogenic Temperatures

Finite Element Simulation Study of the Effects of Kirkendall Voids in IMC Layer on Interfacial Crack and Reliability of Cu–Sn Solder Joint

Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation

Role of Cu microstructure during isothermal aging of Cu/Sn/Cu micro solder joints

Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding

Quasi In-Situ Study Of Morphological Evolution Of The Interfacial Imc In Single-Sided Interface Sn-0.3ag-0.7cu/Cu Joints During Multiple Reflow Process

Size Effect of IMC Growth in Liquid-Solid Reflow Reaction at SAC305/Cu Interface

Effect of Sn Surface Diffusion on Growth Behaviors of Intermetallic Compounds in Cu/ni/snag Microbumps

Microstructural Evolution And Mechanical Behavior Of Line-Type Ni/Sn3.0ag0.5cu/Ni Interconnects With A Small Thickness During Isothermal Aging

Investigation on Cu–Sn Intermetallic Compounds Growth and Signal Transmission Loss of the Diverse Copper Lines after Soldering in Printed Circuit Board

In-situ fusion process and Cu–Sn compounds evolution mechanism of nano-intermetallic compound mixed solder joints

Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint