Surface Passivation Process Study with Polyimide for High Voltage IGBT

Guoqing Leng,Li,Tao Zhu,Di Wu,Jiang Liu,Rui Jin,Jialiang Wen,Yan Pan
DOI: https://doi.org/10.2991/icmmcce-17.2017.81
2017-01-01
Abstract:In this paper, high voltage,high power insulated gate bipolar transistors (IGBT) were fabricated with the passivation layer by photosensitive polyimide (PSPI) process. The PSPI was spin coated on a silicon substrate. The soft bake conditions were firstly discussed. In consideration of thermal properties, a temperature hard bake process was carefully optimized. Finally, the polyimide passivation layer was hardened by exposure to nitrogen at 120 ̊C for 60min+160 ̊C for 60min+240 ̊C for 80min+280 ̊C for 30min+350 ̊C for 60min. Using this optimized cured process, the outgassing effect in post-fabrication heat treatment can be easily eliminated. Threshold Voltage swings observed on IGBTs power devices before and after H3TRB have been correlated to the presence of a PSPI passivation layer. As a result, it verifies passivation quality of the PSPI layer.
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