Abstract:In the pursuit of effective thermal management for electronic devices, it is crucial to develop insulation thermal interface materials (TIMs) that exhibit exceptional through-plane thermal conductivity, low thermal resistance, and minimal compression modulus. Boron Nitride (BN), given its outstanding thermal conduction and insulation properties, has garnered significant attention as a potential material for this purpose. However, previously reported BN-based composites have consistently demonstrated through-plane thermal conductivity below 10 W m -1 K -1 and high compression modulus, whilst also presenting challenges in terms of mass production. In this study, low molecular weight polydimethylsiloxane (PDMS) and large-size BN were utilized as the foundational materials. Utilizing a rolling-curing integrated apparatus, we successfully accomplished the continuous preparation of large-sized, high-adhesion BN films. Subsequent implementation of stacking, cold pressing, and vertical cutting techniques enabled the attainment of a remarkable BN-based TIM, characterized by an unprecedented through-plane thermal conductivity of up to 12.11 W m -1 K -1 , remarkably low compression modulus (55 kPa), and total effective thermal resistance (0.16 o C in 2 /W, 50 Psi). During the TIMs performance evaluation, our TIMs demonstrated superior heat dissipation capabilities compared with commercial TIMs. At a heating power density of 40 W/cm 2 , the steady-state temperature of the ceramic heating element was found to be 10 °C lower than that of the commercial TIMs. This pioneering feat not only contributes valuable technical insights for the development of high-performance insulating TIMs but also establishes a solid foundation for widespread implementation in thermal management applications across a range of electronic devices.

Development of Thermal Conductive tpPI/Oriented h‐BN Insulating Composite Material Using the Electrostatic Adsorption Method

Filler Particle Size Effect on Electrically and Thermally Properties of Thermal Conductive Thermoplastic Polyimide/Hexagonal Boron Nitride Composite Materials Fabricated by the Electrostatic Adsorption Method

Mille-Feuille Inspired Thermally Conductive Polymer Nanocomposites with Overlapping BN Nanosheets for Thermal Management Applications.

Isotropically Ultrahigh Thermal Conductive Polymer Composites by Assembling Anisotropic Boron Nitride Nanosheets into a Biaxially Oriented Network.

Enhanced in-plane thermal conductivity of polyimide-based composites via in situ interfacial modification of graphene

Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader

Epoxy/h-BN Composites Based on Oriented Boron Nitride Platelets with High Thermally Conductivity for Electronic Encapsulation

A highly thermally conductive yet electrically insulating boron nitride nanosheets/polyetherimide composite with oriented structure

Hot-pressing Induced Alignment of Boron Nitride in Polyurethane for Composite Films with Thermal Conductivity over 50 Wm−1 K−1

Thermally conductive poly(ether ether ketone)/boron nitride composites with low coefficient of thermal expansion

Dense Graphene Foam and Hexagonal Boron Nitride Filled PDMS Composites with High Thermal Conductivity and Breakdown Strength

Properties and Application of Polyimide‐based Composites by Blending Surface Functionalized Boron Nitride Nanoplates

Vacuum filtration-assisted design of hierarchical structure in polyimide-BN composite films: Toward enhanced thermal conductivity, low dielectric and electrical insulation

Concurrent enhancement of dimensional stability and thermal conductivity of thermoplastic polyamide 12T/Boron nitride composites by constructing oriented structure

Improved electrical resistivity-temperature characteristics of oriented hBN composites for inhibiting temperature-dependence DC surface breakdown

Boron Nitride Based Poly(Phenylene Sulfide) Compsoites With Enhanced Thermal Conductivity And Breakdown Strength

Highly thermal conductive and electrical insulating polymer composites with boron nitride

Polyimide Composites with Fluorinated Graphene and Functionalized Boron Nitride Nanosheets for Heat Dissipation

Highly thermally conductive polymer composite enhanced by two-level adjustable boron nitride network with leaf venation structure

PDMS/functionalized h-BN/liquid metal flexible composite with dual-network structure for achieving superior thermal conductivity and low thermal resistance via interfacial grafting

Highly oriented BN-based TIMs with high through-plane thermal conductivity and low compression modulus