Abstract:A novel DC-assisted fast hot-pressing (FHP) powder sintering technique was utilized to prepare Al/Diamond composites. Three series of orthogonal experiments were designed and conducted to explore the effects of sintering temperature, sintering pressure, and holding time on the thermal conductivity (TC) and sintering mechanism of an Al-50Diamond composite. Improper sintering temperatures dramatically degraded the TC, as relatively low temperatures (≤520 °C) led to the retention of a large number of pores, while higher temperatures (≥600 °C) caused unavoidable debonding cracks. Excessive pressure (≥100 MPa) induced lattice distortion and the accumulation of dislocations, whereas a prolonged holding time (≥20 min) would most likely cause the Al phase to aggregate into clusters due to surface tension. The optimal process parameters for the preparation of Al-50diamond composites by the FHP method were 560 °C-80 MPa-10 min, corresponding to a density and TC of 3.09 g cm-3 and 527.8 W m-1 K-1, respectively. Structural defects such as pores, dislocations, debonding cracks, and agglomerations within the composite strongly enhance the interfacial thermal resistance (ITR), thereby deteriorating TC performance. Considering the ITR of the binary solid-phase composite, the Hasselman-Johnson model can more accurately predict the TC of Al-50diamond composites for FHP technology under an optimal process with a 3.4% error rate (509.6 W m-1 K-1 to 527.8 W m-1 K-1). The theoretical thermal conductivity of the binary composites estimated by data modeling (Hasselman-Johnson Model, etc.) matches well with the actual thermal conductivity of the sintered samples using the FHP method.

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Enhanced Stability of the Diamond/Al Composites by W Coatings Prepared by the Magnetron Sputtering Method

Mechanical Properties of Al Matrix Composite Reinforced with Diamond Particles with W Coatings Prepared by the Magnetron Sputtering Method

Enhanced Thermal Conductivity of Diamond/aluminum Composites Through Tuning Diamond Particle Dispersion

Interfacial characteristics of diamond/aluminum composites with high thermal conductivity fabricated by squeeze-casting method

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Realizing ultrahigh thermal conductivity in bimodal-diamond/Al composites via interface engineering

Preparation and thermal conductivity of tungsten coated diamond/copper composites

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Progress in the Copper-Based Diamond Composites for Thermal Conductivity Applications

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Preparation of high thermal conductivity copper–diamond composites using molybdenum carbide-coated diamond particles

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Heterogeneous interfacial chemical nature and bonds in a W-coated diamond/Al composite

Enhanced thermal conductivity and flexural properties in squeeze casted diamond/aluminum composites by processing control

Effect of W-coated Diamond on the Microstructure and Thermal Conductivity of Diamond/w Matrix Composites for Plasma-Facing Materials (Pfms)

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Tungsten-coated Diamond Powders Prepared by Microwave-Heating Salt-Bath Plating

Thermal Conductivity and Sintering Mechanism of Aluminum/Diamond Composites Prepared by DC-Assisted Fast Hot-Pressing Sintering

Thermal properties of tungsten/tungsten carbide-coated double-size diamond/copper composite