Microstructures and Tensile Properties of Nano-Sized SiCp/Al-Cu Composites Fabricated by Semisolid Stirring Assisted with Hot Extrusion

Lei Wang,Feng Qiu,Qian Zou,De-Long Yang,Jian Tang,Yu-Yang Gao,Qiang Li,Xue Han,Shi-Li Shu,Fang Chang,Qi-Chuan Jiang
DOI: https://doi.org/10.1016/j.matchar.2017.07.013
IF: 4.537
2017-01-01
Materials Characterization
Abstract:Al-Cu matrix composites containing nano-sized SiCp were successfully prepared by dispersing nano-sized SiCp/Al master alloy into the molten Al-Cu alloy with combined semi-solid stir casting and hot extrusion processes. Microstructures of nano-sized SiCp/Al-Cu composites and their tensile properties were investigated. Results show that the α-Al dendrites became finer and better formed and nano-sized SiCp was formed in the α-Al grains. With nano-sized SiCp adding to the Al-Cu matrix, the tensile strength of the described composites increased remarkably especially under the temperature of 453K, while their plasticity were still high. Nano-sized SiCp particles had been uniformly dispersed in the Al alloy, yielding composites with high strength at elevated temperatures. The strengthening mechanisms of nano-sized SiCp were also discussed. This will raise the probability of using Al matrix composites as lightweight materials for structural applications at elevated temperatures.
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