Influence of Sn on M Icrostructure and Performance of Electric Vacuum Ag-Cu Filler M Etal

SHI Lei,CUI Liang,ZHOU Fei,GU Xiao-long,HE Peng
DOI: https://doi.org/10.11868/j.issn.1001-4381.2016.10.008
2016-01-01
Journal of Materials Engineering
Abstract:Influence of Sn on microstructure ,melting characteristic and brazing performance of electric vacuum Ag‐Cu filler metal was studied by using scanning electronic microscope (SEM ) with energy disperse spectroscopy (EDS) ,differential scanning calorimetry (DSC) and contrast tests .The results show that ,w hile the addition of Sn is 4% (mass fraction ,the same below ) ,there is no brittle β‐Cu phase in Ag60Cu filler metal ,the effect on the processing performance is not obvious ;with the in‐crease of Sn content ,the liquidus temperature of Ag60Cu filler metal decreases gradually ,but the sol‐idus temperature drops drastically ,resulting in wider melting temperature range ,and worse gap filling ability of filler metal .The Ag60Cu filler metal with Sn content of 4% has good spreading and metal‐lurgical bonding abilities on copper plates ,which are closer to that of BAg72Cu filler metal ,and it can be processed into flake filler metal to replace the BAg 72Cu flake filler metal to be used .
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