Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy

Duy Le Han,Yu-An Shen,Siliang He,Hiroshi Nishikawa

DOI: https://doi.org/10.1016/j.msea.2021.140785

2021-02-01

Abstract:<p>The In-48Sn eutectic alloy has emerged as a favorable solder for flexible electronic devices, owing to its low operating temperature. However, the low strength of In-48Sn eutectic alloy compared with that of other commercial solders affects the product life and limits its use in the device applications. Herein, we studied the effects of xCu addition (x = 1.0, 2.0, and 8.0 wt. %) on melting temperature, phase segregation, and mechanical properties of In-Sn alloy. The results revealed that the melting temperatures of the In-Sn-Cu (ISC) alloys were close to that of eutectic In-Sn alloy (115 ˚C) due to the ternary reaction in the ISC alloys. In addition, the initial solidification temperature of the η-(Cu,In,Sn) compound took place below 400 ˚C, and partial solid-transformation to ternary τ-Cu₂In₃Sn occurred in the temperature range 83 – 78 ˚C, owing to the diffusion of Cu-atoms and consumption of the β-In₃Sn phase in the new ISC alloys. The phase segregation affected the phase fraction in the ISC matrix and the mechanical properties of ISC alloys. Furthermore, the In-Sn-1.0Cu alloy exhibited the highest elongation of 74%, which was more than twice that of In-48Sn alloy. Simultaneously, the In-Sn-8.0Cu alloy presented the highest tensile strength of approximately 17.0 MPa, which was 1.5 times that of the In-48Sn alloy.</p>

materials science, multidisciplinary,nanoscience & nanotechnology,metallurgy & metallurgical engineering

What problem does this paper attempt to address?

The paper mainly explores the effects of copper addition on the microstructure and mechanical properties of indium-tin (In–Sn) based low-melting-point alloys. Specifically, the study investigates how adding different weight percentages of copper (1.0 wt%, 2.0 wt%, and 8.0 wt%) to the indium-tin eutectic alloy alters the alloy's melting temperature, phase separation, and mechanical properties.

The main findings include:
1. The initial melting temperature of the new indium-tin-copper (ISC) alloys with added copper is close to the melting temperature of the pure indium-tin eutectic alloy (approximately 115°C), primarily due to the influence of the ternary reaction.
2. The η-(Cu,In,Sn) compound forms in the new alloys and partially transforms into the τ-Cu2In3Sn phase within a certain temperature range (83–78°C).
3. The addition of copper changes the phase separation in the alloy, thereby affecting the alloy's microstructure and mechanical properties.
4. Among the alloys, the In–Sn-1.0Cu alloy exhibits the highest ductility (74%), while the In–Sn-8.0Cu alloy shows the highest tensile strength (approximately 17.0 MPa).

In summary, this study reveals that adding copper can effectively improve the mechanical properties of indium-tin alloys, especially ductility and tensile strength, which is significant for expanding the application of indium-tin alloys in fields such as flexible electronic devices.