Impacts of Temperature Gradient on Microstructure and Properties of Cu/Sn58Bi-0.6B4C NPs/Cu Joints Fabricated by Vacuum Thermal Compression Bonding

Chen,Liang Zhang,Jia-min Zhang,Kai Deng,Xi Huang

DOI: https://doi.org/10.1016/j.mtcomm.2024.108210

IF: 3.8

2024-01-01

Materials Today Communications

Abstract:This study aimed to overcome the limitations posed by the quantity of ceramic nanoparticle in modifying lead-free solder from the process perspective. The research successfully employed vacuum thermal compression bonding to achieve the high-quality Cu/Sn58Bi-0.6B4C NPs/Cu interconnected solder joints rapidly. Concurrently, it investigated the impact of temperature gradients and thermomigration on their microstructure, interface intermetallic compounds (IMC), and mechanical performance. The research revealed that a well-calibrated temperature setting effectively refines the size of β-Sn and the Bi-rich phase and reduces the interfacial IMC thickness. A suitable reduction in temperature gradient significantly diminishes the difference in IMC thickness at both ends, thereby mitigating adverse effects. However, an overall increase in system temperature results in microstructure coarsening and IMC thickness increasing. Besides, the judicious temperature optimization substantially enhances the joints shear strength, which is closely related to changes in microstructure and IMC layers. Inconsistent temperature fluctuations between high and low-temperature regions, as well as an overall elevated system temperature, contribute to an increased propensity for stress concentration, leading to crack initiation and propagation. Under such conditions, a substantial abundance of Cu6Sn5 IMC grains is revealed on the fracture surface. Additionally, the vacuum environment effectively inhibits the formation of voids. In summary, utilizing vacuum thermal compression bonding, in conjunction with an appropriate temperature gradient, effectively enables the rapid and high-quality formation of interconnect solder joints.