Properties of Interface Between Epoxy Resin Layers Cured at Different Times

Chuang Wang,He Li,Lilan Liu,Huidong Tian,Haoran Wang,Zongren Peng
DOI: https://doi.org/10.1109/ichve.2016.7800640
2016-01-01
Abstract:Interfacial materials have been used as transition layers between the conductor metal and the insulation composite in some high voltage power equipment. Epoxy resin composite is one of the most important materials used as the interfacial coating, then an interface between epoxy coating and epoxy insulation composite is formed. Therefore the influence of the epoxy-epoxy interface should be studied. The interface samples are formed by an epoxy resin layer cured on the epoxy resin which has cured with the same procedure. Compared with the sample without the interface, the existence of this interface makes the mechanical properties have different extent reduction. The tensile strength decreases 28.4%. The bending strength decreases 39.5%. The impact strength decreases 39.2%. The results of mechanical strength testes indicates that epoxy resin on both sides of the interface should link through chemical bonds, and the interface may form a "weak crosslinking" area. This interface has little influence on the thermal performance. And in the measurement range, the relative permittivity and dielectric loss show little change too. The existence of this interface formed by curing does not affect the application of the thermal and AC systems.
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