Improving the wet chemical patterning of nichrome film by inserting an ultrathin titanium layer

Weizhi Li,Jun Gou,Jun Wang,Xiongbang Wei
DOI: https://doi.org/10.1063/1.4968177
IF: 1.697
2016-01-01
AIP Advances
Abstract:We studied how to improve the quality of nichrome (NiCr) films patterned with wet chemical etching by inserting an ultrathin titanium film. The experimental results showed that inserting a 20-nm Ti layer between the photoresist (PR) and NiCr greatly improved the quality of the resultant pattern, which had minimal undercut and smooth edges. We attributed this improvement to the improved mask/NiCr interface, which we confirmed by scanning electron microscopy (SEM). In addition, we found that the undercutting of NiCr comprised two stages-an initial, relatively slow undercut stage and a second, faster stage-separated by the critical time point, the time at which the unmasked NiCr film etched away completely. (C) 2016 Author(s).
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