Influence Of The Zinc-Oxide/Salt Content In The Aluminum Soldering Flux On Interfacial Microstructure And Mechanical Property Of Sn-0.7cu/Al Joints In Assembling Led Lighting Components

Guo-Liang Chen,Min-Bo Zhou,Lang Zhang,Yuan-Jiang Lin,Yu-Peng Zhang,Xin-Ping Zhang

DOI: https://doi.org/10.1109/ICEPT.2016.7583287

2016-01-01

Abstract:The effects of zinc-oxide/salt with different contents in the aluminum soldering flux on the interfacial microstructure of Sn-0.7Cu/6061Al and mechanical property of 6061AI/Sn0.7Cu/6061Al joints were investigated. Results show that the flux containing zinc-oxide and zinc-salt can effectively remove the oxide film on surface of 6061Al and result in formation of corrosion pits at the interface of the joints. The depth of the corrosion pits increases with increasing zinc-oxide/salt content in the flux. The tensile strength of 6061AI/Sn-0.7Cu/6061Al joints also increases with increasing zinc-oxide/salt content. A Zn-rich layer forms in the solder matrix side near the interface of Sn0.7Cu/6061Al joints soldered by using the flux containing zincoxide/Zinc-salt, which can improve not only the wettability of the solder but also the electrochemical corrosion resistance of the joints. The zinc-salt in the flux plays a more efficient role in the formation of corrosion pits at the interface of joints, which promote the contact between the solder and substrate for improving interfacial metallurgical bonding and further enhancing the micro-mechanical interlocking, consequently leading to the increase of tensile strength of 6061AI/Sn0.7Cu/6061Al joints.