Effects of Flux Activators and Processing Parameters on Solderability and Stability of the Aluminum Solder Paste Used for Automated Assembly of LED Lighting Components

Lang Zhang,Min-Bo Zhou,Fu-Shun Qiu,Xiao Ma,Xin-Ping Zhang

DOI: https://doi.org/10.1109/icept.2016.7583276

2016-01-01

Abstract:In recent years there has been an increasing demand of aluminum solder pastes used for automated assembly of LED lighting components, such as heat sinks and supporting frames of LED modules. However, it is well-known that soldering of aluminum and its alloys at low soldering temperatures has long been difficult. In this study, the effects of flux activators (i.e., zinc salt A and B, and tin salt A) and processing parameters, such as the peak temperature of heating the flux and soldering heating rate, on the solderability and stability of solder pastes for 6061 aluminum alloy were investigated. The results show that the wettability of solder pastes changes with varying the contents of inorganic salts and the peak temperature used for heating the flux, and the solderability of solder pastes depends strongly on the heating rate used in the reflow soldering. At a low soldering heating rate of 2°C/s, the content of zinc salt A is a key factor in increasing the spreading ability of solder pastes on 6061Al, while the addition of tin salt A decreases the spreading ability. When a relatively high soldering heating rate of 20°C/s was applied, three kinds of inorganic salts show similar effects on the spreading ability, meanwhile, tin salt A is found to be beneficial for improving the solderability of aluminum solder pastes.