Abstract:Electronic devices are progressively fabricated on flexible substrates allowing new fields of applications. A maskless and very flexible structuring process is offered by ablation using ultra-short pulse laser irradiation. Usually, certain areas of a functional thin film coating are locally removed to yield the needed device structures. Micro laser patterning quality is not only influenced by the beam properties (beam profile, fluence) but also by pulse overlap, scan repetitions and many other factors such as substrate and coating material. This makes process parameter optimization a challenging task. In this paper, we present a systematic approach to efficiently find suitable parameters for laser-induced ablation of thin films on susceptible polymer substrates. As an example, we use a sputtered NiCr coating with a thickness of 100 $nm$ on a polyimide film made by spin coating of PI-2611 precursor (@ 2000 $rpm$ > ca. 8 ${\mu}m$, HD microsystems). Irradiation is conducted using a fs-laser with infrared wavelength of 1030 $nm$ and a pulse length of 212 $fs$. The energy per pulse is varied in the range of 0,29 ${\mu}J$ to 4,83 ${\mu}J$, yielding fluence values between 70 $mJ/cm^2$ and 1,11 $J/cm^2$. Ablation threshold fluence for a 100 $nm$ layer of NiCr was found to be ${\phi}_{th}$ ($N_P$:1)=0,50 $J/cm^2$ and the incubation factor was evaluated to be ${\xi}$=0,53. A clear distinction must be made between the material ablation at the surface of a bulk material and the selective removal of a thin film. In the second case effects such as flaking occur in practice and influence the ablation characteristic. We then investigate different varieties of thin film removal including dot-, line- and areal-ablation. The methodology is presented using a practical example, but can be applied to selective ablation of a wide range of thin film systems.

Time-resolved Analysis of Thickness-Dependent Dewetting and Ablation of Silver Films Upon Nanosecond Laser Irradiation

Thickness-dependent spontaneous dewetting morphology of ultrathin Ag films

Integrated Continuum-Atomistic Modeling of Nonthermal Ablation of Gold Nanofilms by Femtosecond Lasers

An Atomic-Level Study of Material Ablation and Spallation in Ultrafast Laser Processing of Gold Films

Temporal-Spatial Measurement of Surface Morphological Evolution Time in Nanosecond Laser Irradiation on the Copper Film

Dynamics of Nanoscale Phase Decomposition in Laser Ablation

Molecular Dynamics Simulation Of Ultra-Fast Thermal Transition In Thin Foil Irradiated By High Power Ultra-Short Laser

Time-resolved Imaging of Microscale Dynamics in Laser Drying of Silicon Wafers

Thermal regime and effect studying on the ablation process of thin films prepared by nanosecond pulsed laser

Nano-ablation of Silica by Plasmonic Surface Wave at Low Fluence.

Femtosecond-Laser-Ablation Dynamics in Silicon Revealed by Transient Reflectivity Change

Preparation of Silver Nanoparticles Colloid by Pulsed Laser Ablation

Methodology of selective metallic thin film ablation from susceptible polymer substrate using pulsed femtosecond laser

Crystallization dynamics of as-deposited amorphous AgInSbTe thin film induced by picosecond laser pulses

Ag Nanoparticles Colloids Produced by Pulsed Laser Ablation in Distilled Water

Simulation of evaporation ablation dynamics of materials by nanosecond pulse laser of Gaussian beam and flat-top beam

The physical mechanisms of short-pulse laser ablation

Controllable Precipitation and Dissolution of Silver Nanoparticles in Ultrafast Laser Pulses Irradiated Ag+-doped Phosphate Glass.

Capturing Plateau-Rayleigh instability in silver nanowires via ultrafast electron microscopy

Physics of picosecond pulse laser ablation

Threshold effect on the femtosecond laser-induced periodic subwavelength structure: An analytical approach