Energy band diagram of metal/Tm2O3/Si stack structure acquired from the study of leakage current mechanisms

Bo Yao,Yanyan Zhu,Zebo Fang,Yongsheng Tan,Shiyan Liu,Junjun Yuan,Qinglin Qiu
DOI: https://doi.org/10.1016/j.tsf.2016.05.015
IF: 2.1
2016-01-01
Thin Solid Films
Abstract:Metal-oxide-semiconductor capacitors with Tm2O3 high-k gate dielectrics were fabricated. Based on the I–V measurements of Al/Tm2O3/Si devices at different temperatures, the leakage current mechanisms for Al/Tm2O3/Si stack structures have been extracted. The results reveal that the dominant conduction mechanisms under substrate injection and gate injection are Schottky emission and Frenkel-Poole conduction, respectively. The determined Schottky barrier height between Tm2O3 and Si is 1.68±0.2eV. The further I–V measurements of Fowler-Nordheim tunneling characteristics at 77K is conducted to the conduction-band offset at the interfaces of Al/Tm2O3 and Pt/Tm2O3, which are 2.95eV and 1.75eV, respectively. The energy band diagrams of the Al (Pt)/Tm2O3/Si stack structures were obtained from the above results, which show that Tm2O3 is a promising candidate for use as high-k gate dielectric on high-performance substrates.
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