Development of Measurements of the Adhesion Strength between Diamond Thin Films and Substrates

简小刚,孙方宏,赵国伟,刘国良,陈明
DOI: https://doi.org/10.3969/j.issn.1006-852X.2002.03.001
2002-01-01
Abstract:Adhesion measurement is one of the key question for the fabrication and application of CVD diamond thin film. In this paper, some typical adhesion measurements on diamond thin films were introduced. And also, the research status and the development direction of adhesion measurements were discussed. A novel bulge-blister test was put forward for the adhesion measurement of diamond thin films deposited on complex-geometries substrate, which can give a foundation for the optimization of fabrication technics and a criterion for the evaluation on the quality of diamond thin films.
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