Abstract:With the widespread use of diamond thin films in mechanical engineering, especially in cutting tools, dies and molds, the insight into adhesive strength between the film and the base is becoming necessary and inevitable. Furthermore, the optimization of diamond thin film fabrication process relies mainly on the precise quantitative evaluation of the adhesive strength. How to obtain the adhesive strength precisely and quantitatively has been the frontier issue to the related scientists and engineers. Many useful practical measurements have been developed and the adhesive strength of diamond thin film can be demonstrated qualitatively very well up to now. But seldom contribution to its quantitative evaluation has been made due to the limitations to both available measurement condition and theoretical modeling. Aiming at solving this problem, the authors presented an innovative experimental method by bulgeiblister tests on base of intensive modeling and simulation. The special equipment for bulge/blister tests was designed purposely and fabricated considering the influential factors such as the sealed connecting under high liquid pressure and dose feeding. The so-called free-standing window of diamond thin films with the support of silicon wafer was obtained by the aid of photolithography and anisotropic wet etching technology. The laser interferometer measurement with fine solution was used to pick up dynamic signals of bulge deformation of diamond thin film in micrometer scale and the relationship between stress and strain of the diamond thin film was available. As a result, the adhesive strength could be obtained precisely and quantitatively by the valid model. In this paper, the average adhesion strength of diamond thin films calculated from the tests of the square membranes is 4.28726 J/m(2). By the comparison of simulation outcomes and the experimental results, experiment system was slightly modified for more practical and reliable measurement. This paper confirms the accessibility to precise quantitative evaluation of the adhesive strength of the diamond thin film and the results will be beneficial to wide application of diamond thin films in the tool-engineering field.

Precise and Quantitative Evaluation of the Adhesive Strength of Diamond Thin Films by Bulge/Blister Test