Abstract:Single crystalline diamond (SCD) grits are usually made by a high-pressure and high-temperature (HPHT) method and exhibit cuboctahedral shapes and smooth surfaces. In this paper, we synthesized new kinds of SCD grits and nanocrystalline diamond (NCD) grits by a chemical vapor deposition (CVD) method and explored their grinding performance by single grit grinding of SiC ceramics. Grinding by HPHT grits was also conducted for comparison. The CVD-SCD grits exhibit cuboctahedral shapes, but surfaces are covered by protruded twin crystals of several microns, while the NCD grits are spherical agglomerations of nano-grains. We demonstrated that these morphological features have profound influences on material removal behavior. Results show that the wear of NCD grits is dominated by wear flat and intergranular cracks. The worn NCD grits can exert intense rubbing and ploughing effects on the workpiece. In contrast, the wear of CVD-SCD grits is dominated by fracture of the protruded twin crystals. It is proved that the twins on the grit surface are effective cutting edges to remove the material in a micro scale and thus lead to the formation of fine grinding striations and smaller cracking pits, but this process has little influence on specific grinding energy. Besides, grits with rough twins, especially on the flank face, tend to exhibit lower grinding force ratios and thus better sharpness. Moreover, for grits with smooth rake faces, there exists an explicit critical undeformed chip thickness value around 0.4–0.6 μm, above which the material removal mechanism changes from ductile to brittle rapidly. However, for grits with rough twins on rake faces, this transition process becomes vague.

Surface Integrity and Removal Mechanism in Grinding Sapphire Wafers with Novel Vitrified Bond Diamond Plates

Observation in the Surface Roughness of Silicon Wafer During Semi-Fixed Abrasive Machining with Large Grains

An Experimental Investigation of Sapphire Grinding by Porous and Vitrified M0.5/1.5 Diamond Grinding Wheel

Effects of processing parameters and grinding direction on the material removal mechanism of (100) surface single crystal diamond in self-rotating mechanical grinding

Wear evolution of metal bond diamond tool in grinding of sapphire

Novel surface characteristics observed during grinding of polycrystalline diamond

Surface and subsurface microscopic characteristics in sapphire ultra-precision grinding

Novel Abrasive-Impregnated Pads and Diamond Plates for the Grinding and Lapping of Single-Crystal Silicon Carbide Wafers

Longitudinal-torsional compound ultrasonic vibration end grinding sapphire: A study on surface topography and roughness

Surface and subsurface cracks characteristics of single crystal SiC wafer in surface machining

High surface integrity fabrication of silicon wafers using a newly developed nonwoven structured grind-polishing wheel

Nanoscale smooth and damage-free polycrystalline diamond surface ground by coarse diamond grinding wheel

Improvement of precision grinding performance of CVD diamond wheels by micro-structured surfaces

Modeling of Material Removal Rate for the Fixed-Abrasive Double-Sided Planetary Grinding of a Sapphire Substrate

Study on the grinding characteristics of sapphire with the assistant of cerium oxide liquid

Piezoelectric Ultrasonic Local Resonant Ultra-Precision Grinding for Hard–Brittle Materials

Lapping of sapphire using developed clusters of diamond and ceria chemically active abrasives

Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process

Grinding characteristics of CVD diamond grits in single grit grinding of SiC ceramics

Machining performance and material removal mechanism of sapphire with novel polishing slurry

Molecular Dynamics Study of Nano-Grinding Behavior for Silicon Wafer Workpieces with Nanoscale Roughness Under Diamond Abrasive Rotation and Translation